5SGXEBBR3H43C4G

The 5SGXEBBR3H43C4G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides very high logic capacity and on‑chip memory in a compact 1760‑ball BGA package for commercial‑grade designs.

Key device attributes include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 600 user I/O pins, a low‑voltage core supply range (820 mV–880 mV), and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core & Logic Capacity  952,000 logic elements provide large-scale programmable logic resources for complex designs.
• On‑Chip Memory  Approximately 53.25 Mbits of total RAM bits for embedded buffering, state storage, and memory‑intensive logic functions.
• I/O Resources  600 I/O pins support extensive peripheral, system, and board-level interfacing in high‑pin‑count applications.
• Power and Voltage  Core supply specified between 820 mV and 880 mV to match low‑voltage FPGA core domains.
• Package and Mounting  1760‑BBGA (FCBGA) package; supplier device package noted as 1760‑HBGA (45×45). Surface‑mount package suitable for compact board designs.
• Commercial Grade & Temperature  Commercial grade device with rated operating temperature from 0 °C to 85 °C.
• Standards and Documentation  Device is part of the Stratix V family; refer to the Stratix V device datasheet for series electrical and switching characteristics, including transceiver and I/O timing details.
• Environmental Compliance  RoHS‑compliant.

Typical Applications

• FPGA‑based System Integration  Use the large logic capacity and embedded memory to consolidate multiple functions and accelerate complex data‑path logic on a single device.
• High‑I/O, High‑Density Boards  600 I/O pins and a compact 1760‑ball BGA footprint enable dense board implementations where abundant routing and signals are required.
• Memory‑Intensive Logic  Approximately 53.25 Mbits of on‑chip RAM supports buffering, packet processing, and other workloads that require substantial embedded memory.

Unique Advantages

• Massive Logic Resources: 952,000 logic elements let you implement large finite‑state machines, datapaths, and custom accelerators without external logic expansion.
• Significant Embedded Memory: Approximately 53.25 Mbits of RAM reduces dependency on external memory for many buffering and storage needs.
• High I/O Count: 600 user I/Os simplify integration with multiple peripherals, mezzanine connectors, or multi‑lane interfaces.
• Compact High‑Ball‑Count Package: 1760‑BBGA (45×45) provides a high‑density package that saves board area while delivering large pin counts.
• Low‑Voltage Core Compatibility: Core supply range of 820 mV–880 mV aligns with modern low‑voltage FPGA power domains.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operating range for mainstream commercial applications.

Why Choose 5SGXEBBR3H43C4G?

The 5SGXEBBR3H43C4G combines very high logic density, substantial on‑chip RAM, and a large I/O complement in a compact FCBGA package. These attributes make it suitable for commercial designs that require on‑device integration of complex logic and memory functions while maintaining a compact board footprint.

Backed by Intel’s Stratix V device family documentation, this FPGA provides a clear specification set—core voltage range, I/O count, memory capacity, and operating temperature—that supports engineering decision making for high‑capacity programmable designs.

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