5SGXEBBR3H43C2N

The 5SGXEBBR3H43C2N is a Stratix V GX FPGA in a 1760-BBGA (FCBGA) package from Intel, designed for high-density, high-performance programmable logic applications. It delivers substantial on-chip logic and memory capacity alongside a large I/O count and a low-voltage core supply, making it suitable for designs that require consolidated digital processing and extensive interfacing.

As a commercial-grade Stratix V GX device, this part targets applications that demand large logic resources, significant embedded RAM, and many external interfaces while operating within a standard commercial temperature range.

Key Features

• Logic Capacity  Provides 952,000 logic elements to implement complex digital functions and high-density designs.
• Embedded Memory  Includes approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, and algorithm state memory.
• High I/O Count  600 I/O pins support extensive external interfacing for multi-channel systems and large mezzanine connectivity.
• Packaging  1760-BBGA (FCBGA) package with supplier package 1760-HBGA (45×45) provides a high-pin-count, surface-mount solution for space-efficient boards.
• Power and Core Supply  Core voltage operating range from 870 mV to 930 mV to match modern low-voltage FPGA power domains.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation suitable for commercial applications.
• Mounting and Compliance  Surface-mount device with RoHS compliance for global manufacturing and environmental requirements.
• Stratix V GX Family  Part of the Stratix V GX devices; refer to the Stratix V device documentation for family-level electrical and transceiver characteristics.

Typical Applications

• High-density logic implementations  Use the large logic element count and embedded memory to consolidate complex functions into a single FPGA.
• Multi-channel I/O systems  Leverage 600 I/Os for systems requiring broad connectivity to sensors, converters, or external controllers.
• Data buffering and packet processing  Embedded RAM provides on-chip storage for latency-sensitive buffering and packet handling tasks.
• Prototyping and advanced FPGA designs  Commercial-grade operation and high resource counts support development of feature-rich prototypes and production designs within the commercial temperature range.

Unique Advantages

• Substantial programmable logic: 952,000 logic elements enable implementation of large-scale digital designs without immediate need for multi-FPGA partitioning.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependencies for many buffering and state-storage tasks.
• Extensive external connectivity: 600 I/Os give designers flexibility to interface with a wide range of peripherals and multi-lane systems.
• High-pin-count FCBGA package: 1760-ball BBGA simplifies routing for dense designs while keeping board footprint optimized.
• Low-voltage core compatibility: Narrow core supply range (870 mV–930 mV) aligns with modern low-voltage FPGA power architectures for efficient power delivery.
• RoHS compliant, surface-mount design: Facilitates compliance with environmental regulations and standard manufacturing processes.

Why Choose 5SGXEBBR3H43C2N?

The 5SGXEBBR3H43C2N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA that brings together nearly one million logic elements, tens of megabits of embedded RAM, and an extensive I/O complement in a single 1760-BBGA package. Its combination of logic density, on-chip memory, and I/O makes it well suited to consolidating complex digital functions on a single device while maintaining the electrical characteristics expected from the Stratix V family.

This part is ideal for engineers and teams building advanced FPGA-based systems that require scalable logic resources and significant embedded memory within a commercial operating environment, backed by Intel's Stratix device documentation for family-level electrical and transceiver characteristics.

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