5SGXEBBR3H43C2LN

The 5SGXEBBR3H43C2LN is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offering a high logic capacity device in a Ball Grid Array package. It combines large on-chip memory, substantial I/O, and a compact FCBGA footprint for demanding commercial designs.

With 952000 logic elements and approximately 53.25 Mbits of embedded memory, this commercial-grade FPGA targets high-density designs that require extensive programmable logic, on-chip RAM, and a high pin count. The device operates within a core supply range of 820 mV to 880 mV and is rated for 0 °C to 85 °C.

Key Features

• Core Capacity — 952000 logic elements provide a very large fabric for complex logic implementation and system integration.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, and stateful logic without external memory dependence.
• I/O Density — 600 I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count mezzanine connections.
• Power — Core supply voltage specified at 820 mV to 880 mV to match system power-rail planning and thermal considerations.
• Package and Mounting — Supplied in a 1760-BBGA FCBGA package; supplier device package listed as 1760-HBGA (45×45). Surface-mount package for PCB assembly.
• Temperature and Grade — Commercial temperature grade with specified operating range of 0 °C to 85 °C.
• Standards — RoHS-compliant for environmental and regulatory planning.

Typical Applications

• High-density logic systems — Implement large-scale custom logic, accelerators, or control fabrics that require nearly one million logic elements and significant on-chip RAM.
• Communications and networking — Leverage the device's high logic count and abundant I/O for packet processing, protocol bridging, and interface aggregation in commercial networking equipment.
• Data processing and acceleration — Use the large embedded memory and logic resources for data-stream buffering, preprocessing, and application-specific acceleration functions.

Unique Advantages

• High integration density: 952000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory support large buffers and stateful logic without immediate external memory overhead.
• Extensive I/O capability: 600 I/O pins enable broad connectivity options for parallel interfaces, high-pin-count peripherals, and modular board designs.
• Compact, manufacturable package: 1760-BBGA/1760-HBGA (45×45) surface-mount package balances board density with assembly compatibility.
• Commercial temperature and RoHS compliance: Designed for standard commercial environments (0 °C to 85 °C) and meets RoHS requirements for material compliance.
• Vendor backing: Manufactured by Intel, providing access to device documentation and supply-chain traceability.

Why Choose 5SGXEBBR3H43C2LN?

This Stratix V GX FPGA delivers a blend of very large logic capacity, significant on-chip memory, and high I/O count in a compact FCBGA package—suited to commercial designs that require scaleable programmable logic and embedded RAM. Its specified operating voltage and temperature range enable clear system-level power and thermal planning for procurement and integration.

Choose 5SGXEBBR3H43C2LN when your design calls for consolidation of complex functions into a single FPGA, a high-density programmable fabric, and a commercially rated, RoHS-compliant solution backed by a major FPGA vendor.

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