5SGXEBBR3H43C4N

The 5SGXEBBR3H43C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC provided in a 1760-BBGA FCBGA package. This commercial-grade device delivers large on-chip logic and memory capacity together with high I/O count for complex, board-level digital designs.

Key device attributes include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 600 I/Os, and a core voltage supply range of 820 mV to 880 mV. The device is specified for commercial operation from 0 °C to 85 °C and is RoHS compliant. For detailed electrical and switching characteristics, refer to the Stratix V device datasheet.

Key Features

• Core capacity  952,000 logic elements for large-scale logic implementation and complex datapath designs.
• Embedded memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and implemented data structures.
• I/O density  600 I/Os to support extensive external interfacing, parallel buses, and multi-channel connectivity.
• Power and supply  Core voltage supply specified from 820 mV to 880 mV to match system power-rail design constraints.
• Package  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45) for PCB footprint planning.
• Operating range  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for regulatory and manufacturing requirements.
• Documented electrical & timing data  Device family datasheet provides detailed electrical characteristics, switching specifications, I/O timing, and programmable I/O/periphery details.

Typical Applications

• High-density digital systems  Large FPGA logic capacity and on-chip RAM make this device suitable for dense digital processing blocks and custom compute fabrics.
• I/O-intensive designs  With 600 I/Os, the device is well suited for applications requiring extensive external interfacing, parallel data paths, or multi-channel I/O aggregation.
• Board-level FPGA integration  The 1760-BBGA package and high pin count support compact, high-functionality board designs where package density is important.

Unique Advantages

• Large logic and memory capacity: 952,000 logic elements combined with approximately 53.25 Mbits of embedded RAM enables complex, memory-intensive designs without external memory for many functions.
• High I/O scalability: 600 I/Os reduce the need for external I/O expanders and simplify routing of multi-channel systems.
• Commercial-grade specification: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product deployments and manufacturing flows.
• Compact, high-pin-count package: 1760-BBGA (FCBGA) provides a high-density mounting option suitable for compact system boards.
• Documented electrical and timing characteristics: Family datasheet includes detailed core, periphery, and I/O timing information for design validation and integration.

Why Choose 5SGXEBBR3H43C4N?

The 5SGXEBBR3H43C4N positions itself as a high-capacity Stratix V GX FPGA for commercial applications that require substantial logic resources, on-chip memory, and extensive I/O. Its combination of 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 600 I/Os in a 1760-BBGA package supports complex, high-density implementations while meeting commercial temperature and RoHS requirements.

This device is suitable for design teams needing a scalable, documented FPGA solution for board-level integration where logic density, embedded memory, and I/O count are primary selection criteria. Consult the Stratix V device datasheet for complete electrical and switching specifications to support system-level validation and integration.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEBBR3H43C4N for your next design.