5SGXEBBR3H43I3LN

The 5SGXEBBR3H43I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering very high logic density and extensive I/O in a 1760-BBGA FCBGA package. It is supplied in an industrial temperature grade and is intended for designs that require large on-chip logic and memory resources with a broad I/O complement.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 user I/O, this device targets complex digital integration where consolidation of functions and high I/O count are required. The device operates with a core supply range of 820 mV to 880 mV and an operating temperature range of –40 °C to 100 °C.

Key Features

• Logic Capacity — 952,000 logic elements for implementing large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, LUT-based storage and intermediate data for high-throughput designs.
• I/O Resources — 600 user I/O pins to accommodate broad external interfacing and multi-protocol glue logic.
• Package & Mounting — 1760-BBGA, FCBGA package; supplier device package 1760-HBGA (45×45); surface-mount for compact board-level integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match low-voltage core requirements.
• Temperature Grade — Industrial operating range from –40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance — RoHS compliant.
• Series-level Transceiver Capability — Stratix V series documentation includes GX and GT transceiver speed grade information (series-level values include GX channel operation up to 14.1 Gbps and GT channel options up to 28.05 Gbps).

Typical Applications

• High-density digital processing — Integrate complex logic, state machines, and custom datapaths on a single device using the large logic-element pool and on-chip memory.
• High-speed communications — Leverage series-level transceiver speed grades in Stratix V devices for high-speed serial links and aggregated data transport.
• Industrial control and automation — Industrial temperature grade and extensive I/O make the device suitable for rugged control and interface applications.
• Large-scale I/O interfacing — Use the 600 I/O pins for multi-channel sensor, actuator, or protocol bridging applications.

Unique Advantages

• Highly dense logic fabric: 952,000 logic elements reduce the need for multiple devices by consolidating extensive logic into a single FPGA.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports buffering, FIFOs, and memory-hungry algorithms without immediate external memory dependence.
• Extensive external connectivity: 600 I/O pins provide flexibility for complex multi-interface designs and high channel counts.
• Industrial-grade thermal range: Rated from –40 °C to 100 °C for deployments requiring extended temperature tolerance.
• Compact, board-friendly package: 1760-BBGA FCBGA (supplier package 1760-HBGA, 45×45) and surface-mount construction simplify PCB layout for dense systems.
• Low-voltage core operation: 820 mV–880 mV core supply enables modern low-voltage power architectures.

Why Choose 5SGXEBBR3H43I3LN?

The 5SGXEBBR3H43I3LN positions itself as a high-capacity Stratix V GX FPGA option for engineers who need significant on-chip logic, memory and a large I/O footprint within an industrial temperature envelope. Its combination of nearly one million logic elements and tens of megabits of embedded RAM enables consolidation of complex systems into a single device.

This device is well suited for development teams and systems that demand high integration density, extensive external interfacing, and industrial temperature operation. The Stratix V family documentation provides series-level transceiver performance options for designs that require high-speed serial connectivity.

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