5SGXEBBR3H43I4G

The 5SGXEBBR3H43I4G is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial-grade FCBGA package. It delivers very large programmable logic capacity and on‑chip memory together with a high pin‑count I/O complement for demanding, high-density designs.

Key attributes include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, 600 I/Os, and operation over an industrial temperature range. Series documentation for Stratix V GX devices also specifies high-speed GX transceiver capability at the series level.

Key Features

• Logic Capacity — 952,000 logic elements and 359,200 logic array blocks (LABs) for large-scale programmable implementations.
• Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support buffering, lookup tables, and working storage for compute tasks.
• I/O Density — 600 user I/Os to accommodate complex interfacing, high channel counts, and wide parallel buses.
• Package & Mounting — 1760‑BBGA FCBGA package (supplier device package: 1760‑HBGA, 45×45 mm) with surface‑mount assembly for high‑pin‑count system integration.
• Power Supply — Core voltage supply range from 820 mV to 880 mV to match system power-rail requirements.
• Temperature Range — Industrial operation from –40°C to 100°C for deployment in extended-temperature environments.
• Series-Level Transceiver Capability — Stratix V GX family documentation includes high-speed GX channel support (series-level specification indicates up to 14.1 Gbps for GX channels).
• Regulatory — RoHS compliant.

Typical Applications

• High‑performance networking and telecom — Large logic resources and series-level GX transceiver capability suit packet processing, line cards, and protocol offload functions.
• Data center acceleration — Dense logic and on‑chip memory enable custom accelerators, search and match engines, and dataflow processing.
• Industrial control and automation — Industrial temperature rating and abundant I/Os support factory automation, motion control, and real‑time signal aggregation.
• Signal processing and test equipment — High logic count and embedded RAM provide the capacity for complex DSP pipelines, high‑speed capture, and preprocessing tasks.

Unique Advantages

• Massive programmable fabric: 952,000 logic elements deliver the scale required for multi‑function, system‑level designs without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory dependency and improves deterministic data paths.
• High I/O count: 600 I/Os enable wide parallel interfaces, extensive sensor/port connectivity, and high‑channel I/O designs.
• Industrial readiness: Rated for –40°C to 100°C operation for reliability in extended‑temperature deployments.
• High‑pin‑count packaging: 1760‑pin BBGA/FCBGA form factor supports complex board routing and high-speed signal integrity considerations.
• Standards‑aligned series capability: Stratix V GX series documentation describes high-speed transceiver support and speed-grade options to address a range of bandwidth requirements.

Why Choose 5SGXEBBR3H43I4G?

The 5SGXEBBR3H43I4G positions itself as a high-density, industrial-grade FPGA for system designs that demand extensive logic, abundant embedded RAM, and a large I/O footprint. Its packaging and operating specifications make it suitable for complex boards where integration density and robust environmental performance are required.

Engineers designing high-throughput networking, compute acceleration, industrial automation, or advanced signal-processing systems will find the combination of logic scale, on‑chip memory, and I/O resources useful for consolidating functions and simplifying system architecture. Series-level electrical and transceiver characteristics are documented in the Stratix V GX device datasheet to support detailed system design and validation.

Request a quote or submit a pricing inquiry to evaluate 5SGXEBBR3H43I4G for your next high-density FPGA design.