5SGXMA3E1H29C1G

IC FPGA 600 I/O 780HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA

Quantity 770 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-HBGA (33x33)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXMA3E1H29C1G – Stratix® V GX FPGA, 340,000 logic elements

The 5SGXMA3E1H29C1G is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, delivering high logic density and substantial embedded memory in a compact BGA package. It is part of the Stratix V GX family and provides a combination of logic capacity, on-chip RAM, and I/O to address demanding programmable-logic applications.

Key on-chip resources include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 I/O pins. The device is supplied in a 780-BBGA FCBGA package and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

  • Core Density  340,000 logic elements for high-capacity programmable logic implementation.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffering and fast local storage.
  • I/O Capacity  600 dedicated I/O pins to support complex system interfaces and multi-channel designs.
  • Package & Mounting  780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting.
  • Power  Core voltage supply specified from 870 mV to 930 mV.
  • Temperature Grade  Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing environments.

Unique Advantages

  • High logic capacity: 340,000 logic elements reduce the need for multiple devices in large designs.
  • Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory supports data-intensive tasks and local buffering.
  • Extensive I/O count: 600 I/O pins enable broad peripheral and high-channel connectivity without external expanders.
  • Compact, high-density package: 780-BBGA (33×33) simplifies board-level integration for space-constrained systems.
  • Low-voltage core supply: 870–930 mV core voltage aligns with modern low-voltage system architectures.
  • Commercial-temperature rating: Specified 0 °C to 85 °C for standard commercial deployments.

Why Choose 5SGXMA3E1H29C1G?

5SGXMA3E1H29C1G offers a balanced combination of high logic density, significant on-chip memory, and a large number of I/O in a compact BGA package, making it suitable for complex programmable-logic designs that require integration and scalable resources. As a member of the Stratix V GX family, it is documented within the Stratix V device datasheet from Intel/Altera, providing detailed electrical and switching characteristics to support system design and validation.

This device is positioned for customers and designs that need substantial programmable resources and dense I/O in a commercial-grade FPGA, backed by manufacturer documentation and specifications for reliable integration.

Request a quote or submit a purchase inquiry for 5SGXMA3E1H29C1G to evaluate fit for your next high-density FPGA design.

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