5SGXMA3E1H29C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 19456000 340000 780-BBGA, FCBGA |
|---|---|
| Quantity | 770 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-HBGA (33x33) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXMA3E1H29C1G – Stratix® V GX FPGA, 340,000 logic elements
The 5SGXMA3E1H29C1G is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, delivering high logic density and substantial embedded memory in a compact BGA package. It is part of the Stratix V GX family and provides a combination of logic capacity, on-chip RAM, and I/O to address demanding programmable-logic applications.
Key on-chip resources include 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 600 I/O pins. The device is supplied in a 780-BBGA FCBGA package and is rated for commercial temperature operation (0 °C to 85 °C).
Key Features
- Core Density 340,000 logic elements for high-capacity programmable logic implementation.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support large buffering and fast local storage.
- I/O Capacity 600 dedicated I/O pins to support complex system interfaces and multi-channel designs.
- Package & Mounting 780-BBGA, FCBGA package; supplier device package listed as 780-HBGA (33×33); surface-mount mounting.
- Power Core voltage supply specified from 870 mV to 930 mV.
- Temperature Grade Commercial grade operation from 0 °C to 85 °C.
- Environmental Compliance RoHS compliant for lead-free manufacturing environments.
Unique Advantages
- High logic capacity: 340,000 logic elements reduce the need for multiple devices in large designs.
- Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory supports data-intensive tasks and local buffering.
- Extensive I/O count: 600 I/O pins enable broad peripheral and high-channel connectivity without external expanders.
- Compact, high-density package: 780-BBGA (33×33) simplifies board-level integration for space-constrained systems.
- Low-voltage core supply: 870–930 mV core voltage aligns with modern low-voltage system architectures.
- Commercial-temperature rating: Specified 0 °C to 85 °C for standard commercial deployments.
Why Choose 5SGXMA3E1H29C1G?
5SGXMA3E1H29C1G offers a balanced combination of high logic density, significant on-chip memory, and a large number of I/O in a compact BGA package, making it suitable for complex programmable-logic designs that require integration and scalable resources. As a member of the Stratix V GX family, it is documented within the Stratix V device datasheet from Intel/Altera, providing detailed electrical and switching characteristics to support system design and validation.
This device is positioned for customers and designs that need substantial programmable resources and dense I/O in a commercial-grade FPGA, backed by manufacturer documentation and specifications for reliable integration.
Request a quote or submit a purchase inquiry for 5SGXMA3E1H29C1G to evaluate fit for your next high-density FPGA design.

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