5SGXEBBR3H43I3G

The 5SGXEBBR3H43I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering very large logic capacity and on-chip memory in a high-pin FCBGA package. This device is designed for applications that demand substantial programmable logic, large embedded RAM, and extensive I/O connectivity.

With 952,000 logic elements, approximately 53.248 Mbits of embedded memory and 600 I/Os, the device targets high-density, industrial-temperature designs where integration, I/O count and memory capacity are key design drivers.

Key Features

• Core Logic — 952,000 logic elements provide very large programmable logic capacity for complex FPGA implementations.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support deep buffering, large state machines and memory-intensive functions.
• I/O Density — 600 user I/Os to support wide parallel interfaces and dense connectivity to peripherals and high-speed PHYs.
• Power — Core voltage supply range of 820 mV to 880 mV to align with the device’s specified operating conditions.
• Package & Mounting — Surface-mount FCBGA in a 1760-BBGA package (supplier device package 1760-HBGA, 45×45 mm) for high-pin-count board designs.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance — RoHS compliant.
• Series transceiver capability (series-level) — Stratix V GX devices (series information from datasheet) support multiple transceiver speed grades, including GX channel options up to 14.1 Gbps.

Typical Applications

• High-performance networking and telecom — Large logic capacity, high I/O count and series-level high-speed transceiver support suit packet processing, line cards and protocol offload tasks.
• Data center acceleration — High logic density and substantial on-chip memory enable custom accelerators, datapath offload and aggregation functions.
• Signal processing and video systems — Abundant logic and embedded RAM support parallel pipelines, real-time processing and large buffer requirements.

Unique Advantages

• High logic density: 952,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O: 600 I/Os provide flexibility to interface with numerous peripherals, high-speed PHYs and wide parallel buses.
• Industrial robustness: Industrial-grade qualification and −40 °C to 100 °C operating range support deployments in demanding environments.
• High-pin FCBGA package: The 1760-BBGA (1760-HBGA supplier package) delivers high signal density in a compact footprint for advanced board designs.
• Power-aligned core: Defined supply range (820–880 mV) supports predictable power planning for system integration.

Why Choose 5SGXEBBR3H43I3G?

This Stratix V GX FPGA part combines very large programmable logic, a significant pool of embedded RAM and broad I/O in an industrial-grade FCBGA package, offering a platform suitable for high-density, high-throughput designs. It is well suited to engineers and systems designers who require a single-device solution to implement complex datapaths, large state machines and memory-heavy applications while maintaining operation across an extended temperature range.

Choosing this device provides scalability for demanding applications and leverages the Stratix V series capabilities documented in the device datasheet, including series transceiver speed grade options and industrial speed grades where applicable.

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