5SGXEBBR2H43I3LG

The 5SGXEBBR2H43I3LG is a Stratix V GX field programmable gate array from Intel, provided in a 1760‑BBGA (FCBGA) package and specified for industrial temperature operation. It delivers a high logic density FPGA architecture with on-chip memory and multi‑hundred I/O capability for complex, high‑integration designs.

This device is targeted at applications that require significant programmable logic, embedded memory, and high‑speed I/O resources. As part of the Stratix V GX series, the device conforms to the series' electrical and transceiver characteristics as documented in the Stratix V device datasheet.

Key Features

• High Logic Capacity — 952,000 logic elements to implement large FPGA designs and complex custom logic.
• On‑Chip Memory — Approximately 53 Mbits of embedded memory (total RAM bits: 53,248,000) for buffering, firmware storage, and data‑path implementation.
• Logic Blocks — 359,200 logic blocks (LAB/CLB count reported) to structure large logic fabrics and hierarchical designs.
• Rich I/O Count — 600 user I/Os to interface with peripherals, memory, transceivers, and board‑level signals.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Low‑Voltage Core — Core voltage supply specified from 820 mV to 880 mV to match system power delivery and thermal budgets.
• Package and Mounting — 1760‑BBGA FCBGA package (supplier package listed as 1760‑HBGA, 45×45) with surface‑mount mounting for high‑pin‑count board designs.
• Series Transceiver Capability — As a Stratix V GX series device, the family documentation describes GX transceivers supporting multi‑Gbps channel rates (series specification).
• RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

• High‑Speed Communications and Networking — Leverage the Stratix V GX series transceiver capabilities and dense logic to implement multi‑Gbps links and packet processing pipelines.
• Data Path and Packet Processing — Large logic element count and significant embedded RAM enable complex data‑path acceleration, buffering, and custom packet handling.
• Industrial Control and Instrumentation — Industrial temperature rating and abundant I/Os support robust control systems, sensor aggregation, and deterministic I/O interfacing.
• Custom Hardware Acceleration — High logic density and on‑chip memory make the device suitable for FPGA‑based accelerators and algorithm offload in compute‑intensive designs.

Unique Advantages

• High Integration Density: 952,000 logic elements and approximately 53 Mbits of embedded memory reduce external components and simplify system architecture.
• Extensive I/O Resources: 600 I/Os provide flexible interfacing options for high‑pin‑count systems and multi‑channel designs.
• Industrial Reliability: Specified operation from −40 °C to 100 °C supports deployment in demanding industrial environments.
• Optimized Power Envelope: Core voltage specified between 820 mV and 880 mV allows designers to target efficient power delivery and thermal management strategies.
• High‑Pin‑Count Package: 1760‑BBGA (FCBGA) package delivers the pin count needed for dense routing and high‑bandwidth board integration.
• Backed by Stratix V Series Documentation: Device electrical and transceiver characteristics are supported by the Stratix V device datasheet for design guidance and system integration.

Why Choose 5SGXEBBR2H43I3LG?

The 5SGXEBBR2H43I3LG positions itself as a high‑capacity Stratix V GX FPGA aimed at designers requiring a combination of large logic resources, substantial on‑chip memory, and many I/O channels within an industrial temperature envelope. Its package and power specifications support dense board implementations where integration and signal routing are priorities.

Choose this device for demanding embedded and communication‑centric designs where series‑documented transceiver capabilities, high logic density, and industrial temperature operation provide the foundation for scalable, robust hardware solutions supported by Intel’s Stratix V documentation.

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