5SGXEBBR2H43I2LN

The 5SGXEBBR2H43I2LN is a Stratix V GX field programmable gate array from Intel, offering high-density programmable logic in a 1760-ball BGA package. It provides a large logic fabric with significant on-chip memory and a high pin count, targeted at industrial applications requiring robust temperature and power operating ranges.

Key device attributes include 952,000 logic elements, approximately 53.248 Mbits of embedded memory, 600 I/Os, a low-voltage core supply range of 820 mV to 880 mV, and an industrial operating temperature range from −40 °C to 100 °C.

Key Features

• High-density programmable fabric 952,000 logic elements provide extensive resources for complex custom logic, signal processing, and system integration.
• On-chip memory Approximately 53.248 Mbits of total RAM bits for large buffers, FIFOs, and embedded storage without external memory dependence.
• High I/O count 600 configurable I/Os to support wide peripheral connectivity and high-pin-count system interfaces.
• Package & mounting Delivered in a 1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface-mount mounting type enables compact board-level integration.
• Core supply & power Core supply voltage specified from 820 mV to 880 mV to match low-voltage FPGA power domains.
• Industrial temperature grade Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance RoHS compliant to support lead‑free manufacturing and regulatory requirements.

Typical Applications

• Industrial control and automation — Industrial temperature grade and robust on-chip resources support programmable control, sequencing, and real-time logic tasks in factory and process equipment.
• High-density digital processing — Large logic capacity and substantial embedded RAM enable complex signal processing, data handling, and algorithm acceleration on a single device.
• High-pin-count interface hubs — With 600 I/Os, the device can aggregate and translate multiple peripheral interfaces or act as an I/O concentrator in dense systems.

Unique Advantages

• Large programmable resource pool: 952,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
• Significant embedded memory: Approximately 53.248 Mbits of on-chip RAM minimizes external memory bandwidth and board complexity for buffer- and state-intensive designs.
• High I/O density: 600 I/Os enable broad connectivity and flexible interfacing without additional I/O expanders.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting reliable deployment in harsh environments.
• Compact BGA footprint: 1760-ball package (45×45 supplier package) balances high integration with manageable PCB routing for high-density designs.
• Low-voltage core compatibility: 820–880 mV supply range aligns with modern low-power FPGA power domains for efficient system designs.

Why Choose 5SGXEBBR2H43I2LN?

The 5SGXEBBR2H43I2LN delivers a combination of very large logic capacity, substantial embedded memory, and high I/O count in a single industrial-grade Stratix V GX FPGA package from Intel. These attributes make it well suited for engineers building complex, high-density programmable systems that require sustained operation across a wide temperature range.

Designed for scalability and integration, the device supports consolidated system designs that benefit from reduced BOM complexity and tighter board-level integration, while being backed by Stratix V family documentation and Intel’s device resources.

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