5SGXEBBR2H43I3L

The 5SGXEBBR2H43I3L is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offering very high logic density and abundant on-chip memory for complex digital designs. As a member of the Stratix V GX family, the device is intended for applications that require large programmable logic, extensive I/O count, and industrial temperature operation.

Key value comes from its combination of nearly one million logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 I/O pins, packaged in a 1760-ball BGA for surface-mount assembly. The device targets designs that demand high integration density and robust operating conditions.

Key Features

• Core Logic  952,000 logic elements (cells) to implement large, complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Capacity  Up to 600 general-purpose I/O pins to support broad connectivity and parallel interfaces.
• Device Family  Stratix V GX family device — part of a product line with documented transceiver and speed-grade options.
• Power Supply  Core voltage range specified at 820 mV to 880 mV for the device core supply domain.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Complex state machines, algorithm acceleration, and large-bitwidth datapaths that require extensive logic and embedded RAM.
• Networking & communications equipment  Designs that benefit from high I/O counts and the Stratix V GX family’s transceiver-capable architecture for interfacing multiple channels.
• Industrial control & automation  Rugged applications requiring industrial temperature range and high integration to consolidate control, monitoring, and interfacing functions.

Unique Advantages

• High logic density: 952,000 logic elements enable consolidation of large design functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers, tables, and state storage without external memory.
• Extensive I/O capability: Up to 600 I/O pins provide flexibility for parallel interfaces, GPIO expansion, and multi-channel connectivity.
• Industrial temperature performance: Rated from −40 °C to 100 °C to meet the environmental demands of industrial applications.
• Compact, production-ready package: 1760-ball BGA in a surface-mount format (supplier package 1760-HBGA, 45×45) suitable for automated PCB assembly.
• Low core-voltage operation: Core supply specified between 820 mV and 880 mV to align with modern FPGA power domains and design rules.

Why Choose 5SGXEBBR2H43I3L?

The 5SGXEBBR2H43I3L brings a blend of very high logic capacity, significant on-chip memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA. This combination is well suited to engineering teams consolidating complex digital functions, implementing high-throughput data paths, or building multi-interface systems where board-level integration and environmental robustness matter.

Designed for demanding embedded and communications applications, the device provides a scalable platform for designs that require substantial programmable resources while maintaining industrial temperature operation and RoHS compliance.

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