5SGXEBBR2H43I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,341 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEBBR2H43I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEBBR2H43I2N is a Stratix V GX family field-programmable gate array (FPGA) in a 1760‑BBGA FCBGA package designed for industrial-grade embedded and high-performance system designs. The device combines a large logic fabric with abundant on-chip memory and dense I/O to address complex digital processing, high-speed interfacing, and system integration requirements.
With approximately 952,000 logic elements, roughly 53.25 Mbits of embedded memory, and 600 I/O pins, this FPGA is positioned for applications that require high gate density, extensive connectivity, and robust operating range. The series datasheet also documents GX transceiver channel options for high-speed serial links.
Key Features
- Logic Capacity — Approximately 952,000 logic elements to implement large-scale digital designs and complex datapaths.
- Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support buffering, large LUTs, and embedded data structures.
- I/O Density — 600 I/O pins for extensive external interfacing and parallel connectivity.
- High‑speed Transceiver Options (series) — Stratix V GX series documentation lists GX channel transceiver options (series datasheet), enabling designs that leverage high-speed serial links where required.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
- Core Voltage — Supported supply range of 870 mV to 930 mV for core power planning and multi‑rail system design.
- Package & Mounting — 1760‑BBGA (FCBGA) supplier package 1760‑HBGA (45×45) in a surface‑mount form factor for high-density PCB integration.
- RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.
Typical Applications
- High‑performance networking — Use the device’s high logic capacity and series transceiver options for packet processing, switching fabrics, and protocol bridging.
- Data acquisition and signal processing — Large embedded memory and dense logic resources support buffering, DSP pipelines, and real‑time processing tasks.
- Industrial control and automation — Industrial temperature rating and abundant I/O make the FPGA suitable for complex control systems, motion control, and sensor aggregation.
- Test and measurement — High logic density and extensive I/O enable custom measurement electronics, data logging, and frontend processing.
Unique Advantages
- Large programmable fabric: Approximately 952,000 logic elements provide the capacity to consolidate multiple subsystems into a single device, reducing board-level complexity.
- Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑flow tasks.
- High I/O count: 600 I/O pins enable broad peripheral connectivity and high channel counts without extensive multiplexing.
- Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environments.
- Compact surface‑mount package: The 1760‑BBGA (FCBGA) package delivers a dense solution for space‑constrained PCBs while maintaining thermal and signal integrity considerations.
- Standards‑ready lifecycle: RoHS compliance aligns the device with current environmental manufacturing requirements.
Why Choose 5SGXEBBR2H43I2N?
The 5SGXEBBR2H43I2N combines high logic density, substantial embedded memory, and extensive I/O in an industrial‑grade Stratix V GX FPGA package. It is suited to engineers building complex digital systems that require consolidated logic, on‑chip memory for high‑throughput data handling, and a large number of external interfaces.
For designs that demand scalability and durability, this FPGA offers a balance of compute resources, memory, and I/O in a surface‑mount 1760‑BBGA package, supported by the Stratix V series documentation and power/operating specifications for reliable deployment.
Request a quote or submit your requirements to get pricing and lead‑time information for the 5SGXEBBR2H43I2N. Our team can assist with availability and supply details to support your design schedule.

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