5SGXEBBR2H43I2N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 1,341 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEBBR2H43I2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEBBR2H43I2N is a Stratix V GX family field-programmable gate array (FPGA) in a 1760‑BBGA FCBGA package designed for industrial-grade embedded and high-performance system designs. The device combines a large logic fabric with abundant on-chip memory and dense I/O to address complex digital processing, high-speed interfacing, and system integration requirements.

With approximately 952,000 logic elements, roughly 53.25 Mbits of embedded memory, and 600 I/O pins, this FPGA is positioned for applications that require high gate density, extensive connectivity, and robust operating range. The series datasheet also documents GX transceiver channel options for high-speed serial links.

Key Features

  • Logic Capacity — Approximately 952,000 logic elements to implement large-scale digital designs and complex datapaths.
  • Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support buffering, large LUTs, and embedded data structures.
  • I/O Density — 600 I/O pins for extensive external interfacing and parallel connectivity.
  • High‑speed Transceiver Options (series) — Stratix V GX series documentation lists GX channel transceiver options (series datasheet), enabling designs that leverage high-speed serial links where required.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet industrial environmental requirements.
  • Core Voltage — Supported supply range of 870 mV to 930 mV for core power planning and multi‑rail system design.
  • Package & Mounting — 1760‑BBGA (FCBGA) supplier package 1760‑HBGA (45×45) in a surface‑mount form factor for high-density PCB integration.
  • RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.

Typical Applications

  • High‑performance networking — Use the device’s high logic capacity and series transceiver options for packet processing, switching fabrics, and protocol bridging.
  • Data acquisition and signal processing — Large embedded memory and dense logic resources support buffering, DSP pipelines, and real‑time processing tasks.
  • Industrial control and automation — Industrial temperature rating and abundant I/O make the FPGA suitable for complex control systems, motion control, and sensor aggregation.
  • Test and measurement — High logic density and extensive I/O enable custom measurement electronics, data logging, and frontend processing.

Unique Advantages

  • Large programmable fabric: Approximately 952,000 logic elements provide the capacity to consolidate multiple subsystems into a single device, reducing board-level complexity.
  • Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑flow tasks.
  • High I/O count: 600 I/O pins enable broad peripheral connectivity and high channel counts without extensive multiplexing.
  • Industrial robustness: −40 °C to 100 °C operating range supports deployment in demanding environments.
  • Compact surface‑mount package: The 1760‑BBGA (FCBGA) package delivers a dense solution for space‑constrained PCBs while maintaining thermal and signal integrity considerations.
  • Standards‑ready lifecycle: RoHS compliance aligns the device with current environmental manufacturing requirements.

Why Choose 5SGXEBBR2H43I2N?

The 5SGXEBBR2H43I2N combines high logic density, substantial embedded memory, and extensive I/O in an industrial‑grade Stratix V GX FPGA package. It is suited to engineers building complex digital systems that require consolidated logic, on‑chip memory for high‑throughput data handling, and a large number of external interfaces.

For designs that demand scalability and durability, this FPGA offers a balance of compute resources, memory, and I/O in a surface‑mount 1760‑BBGA package, supported by the Stratix V series documentation and power/operating specifications for reliable deployment.

Request a quote or submit your requirements to get pricing and lead‑time information for the 5SGXEBBR2H43I2N. Our team can assist with availability and supply details to support your design schedule.

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