5SGXEBBR2H43I2G

The 5SGXEBBR2H43I2G is an Intel Stratix® V GX field-programmable gate array (FPGA) device that delivers a large programmable logic fabric combined with substantial on-chip memory and high I/O density. This device provides 952,000 logic elements and approximately 53.25 Mbits of embedded memory in a high-pin-count FCBGA package.

Specified in an industrial temperature grade and approved as RoHS compliant, the device supports a core supply range of 870 mV to 930 mV and an operating temperature range of −40 °C to 100 °C. Refer to the Stratix V device datasheet for detailed electrical and switching characteristics and available transceiver speed grades.

Key Features

• Core Logic  952,000 logic elements provide extensive programmable logic capacity for large, complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, packet storage, and on-chip data structures.
• High I/O Count  600 user I/Os to support dense external interfaces and multiple parallel buses.
• Power  Core voltage supply specified from 870 mV to 930 mV to allow precise power provisioning for the device core.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory  RoHS compliant.

Typical Applications

• Large-scale programmable logic designs: Utilize the high logic element count and on-chip RAM for complex algorithms and state machines.
• High-density I/O systems: Leverage 600 I/Os for multi-channel interfaces, parallel data paths, or I/O-rich boards.
• Industrial electronics: Industrial temperature rating supports deployment in systems exposed to extended temperature ranges.

Unique Advantages

• Extensive logic capacity: 952,000 logic elements enable consolidation of multi-component designs into a single FPGA, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory requirements.
• High I/O integration: 600 I/Os allow flexible, simultaneous connectivity to multiple peripherals and high-bandwidth external interfaces.
• Industrial temperature operation: Rated from −40 °C to 100 °C for reliable operation across extended environmental conditions.
• Dense, surface-mount package: 1760-ball FCBGA/HBGA package (45×45 mm supplier footprint) provides a compact, high-pin-count solution for space-constrained boards.
• RoHS compliant: Conforms to RoHS requirements for environmentally conscious designs.

Why Choose 5SGXEBBR2H43I2G?

The 5SGXEBBR2H43I2G combines a very large logic fabric, substantial embedded memory, and a high I/O count in a single industrial-grade Stratix V GX device. Its combination of capacity, I/O density, and extended operating temperature makes it well suited to demanding, high-density FPGA designs that require both logic and memory integration.

Engineers seeking a scalable, high-capacity FPGA solution benefit from the device’s integration and Intel’s Stratix V family documentation for detailed guidance on electrical characteristics and transceiver options. The device’s RoHS compliance and surface-mount 1760-ball package support modern manufacturing requirements.

Request a quote or submit a procurement inquiry for the Intel Stratix® V GX 5SGXEBBR2H43I2G to evaluate availability and pricing for your next design.