5SGXEBBR2H43C3G

The 5SGXEBBR2H43C3G is a Stratix® V GX field-programmable gate array offering high-density programmable logic and on-chip memory in a 1760-BBGA FCBGA package. This commercial-grade device provides 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 600 user I/Os for I/O‑dense and memory‑intensive FPGA designs.

Designed for applications that require large amounts of programmable logic and extensive I/O, the device operates from a core supply range of 820 mV to 880 mV and is rated for commercial temperatures from 0 °C to 85 °C. It is RoHS compliant and provided in a surface-mount 1760-HBGA (45 × 45 mm) supplier package.

Key Features

• High Logic Density — 952,000 logic elements suitable for large, complex logic implementations and advanced algorithm mapping.
• Substantial Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, packet processing, and large data structures on-chip.
• Extensive I/O — 600 user I/Os for wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Transceiver and Switching Characteristics (Stratix V GX family) — Device belongs to the Stratix V GX family with documented electrical and switching characteristics for high-speed serial transceivers and programmable I/O timing.
• Power Supply — Core voltage supply range: 820 mV to 880 mV for defined operating conditions.
• Package and Mounting — 1760-BBGA, FCBGA package; supplier device package listed as 1760-HBGA (45 × 45 mm); surface-mount mounting type for automated PCB assembly.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-speed serial connectivity — Stratix V GX family transceiver characteristics enable deployment in designs requiring high-speed serial channels and protocol bridging.
• I/O‑dense interface hubs — 600 I/Os make the device suitable for multi-protocol front-end aggregation, wide parallel buses, and dense board-level interfacing.
• Memory‑heavy FPGA processing — Approximately 53.25 Mbits of embedded RAM supports large buffers, packet processing, and on-chip data structures for real-time processing tasks.

Unique Advantages

• High integration density: 952,000 logic elements allow consolidation of complex functions into a single FPGA, reducing BOM and board count.
• Large on-chip memory: Approximately 53.25 Mbits of RAM minimizes external memory dependence and improves data-path latency.
• Ample I/O connectivity: 600 I/Os enable broad peripheral and high-channel-count system connectivity without immediate need for external I/O expanders.
• Surface-mount BBGA packaging: 1760‑BBGA/1760‑HBGA (45 × 45 mm) footprint supports compact, manufacturable designs for automated assembly.
• Commercial temperature operation: 0 °C to 85 °C rating aligns with a wide range of commercial electronic products and deployments.
• RoHS compliance: Environmentally compliant for markets requiring lead‑free component selection.

Why Choose 5SGXEBBR2H43C3G?

The 5SGXEBBR2H43C3G combines very high logic capacity, substantial on-chip RAM, and a large I/O complement in a compact BGA package, making it well suited for complex FPGA designs that require integration of data-heavy processing and extensive interfacing. Its documented Stratix V GX family electrical and transceiver characteristics support deployment in high-speed serial and switching applications where predictable I/O and transceiver behavior matter.

This commercial‑grade Stratix V device is appropriate for engineering teams seeking a high-density, RoHS‑compliant FPGA solution with clear operating voltage and temperature boundaries, backed by comprehensive device documentation from the Stratix V family.

Request a quote or submit an inquiry for pricing and availability of 5SGXEBBR2H43C3G to evaluate it for your next FPGA design.