5SGXEBBR2H43C3N

The 5SGXEBBR2H43C3N is a Stratix V GX family FPGA from Intel, providing high logic density and substantial embedded memory in a 1760-ball BGA (FCBGA) package. This commercial-grade device is targeted at designs that require a large number of logic elements, extensive I/O, and on-chip RAM for complex programmable hardware implementations.

Key device characteristics include 952,000 logic elements, approximately 53.25 Mbits of embedded memory, up to 600 I/Os, and a low core voltage range of 820 mV to 880 mV. As a member of the Stratix V GX series, the family supports high-speed transceiver options across defined speed grades (transceiver speeds vary by grade).

Key Features

• Core Logic  Approximately 952,000 logic elements for high-density programmable logic and complex system integration.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffering, FIFOs, and memory-intensive algorithms.
• I/O Resources  Up to 600 I/Os to support broad external interfacing and multi-channel connectivity.
• Power and Supply  Core supply voltage range of 820 mV to 880 mV, enabling targeted power-domain design and performance tuning.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount device suitable for modern PCB assembly.
• Temperature and Grade  Commercial grade; specified operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, meeting common environmental requirements for lead-free assembly.
• Stratix V GX Family Capabilities  As a Stratix V GX device, the family includes high-speed transceiver support across defined speed grades (transceiver data rates and availability depend on selected speed grade as documented in the device series datasheet).

Typical Applications

• High-density logic implementations  Use where a large programmable fabric is required—leveraging 952,000 logic elements to implement complex state machines, datapaths, and custom accelerators.
• Memory-intensive designs  On-chip memory capacity of approximately 53.25 Mbits supports buffering, packet storage, and embedded data queues without immediate external memory dependency.
• Multi-interface systems  Up to 600 I/Os enable broad connectivity for systems that require many parallel or multiplexed external interfaces.

Unique Advantages

• High integration density: The large logic element count consolidates complex functions into a single device, reducing BOM and board-level interconnect.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM enables sizable on-chip data storage for streaming, buffering, and intermediate processing tasks.
• Extensive I/O capability: With up to 600 I/Os, the device supports diverse external interfaces and multi-channel designs without immediate need for expansion devices.
• Compact, production-ready package: 1760-ball BGA (FCBGA) surface-mount package suitable for advanced PCB layouts and automated assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Environmental compliance: RoHS compliant to align with lead-free manufacturing requirements.

Why Choose 5SGXEBBR2H43C3N?

The 5SGXEBBR2H43C3N combines very high logic density and significant embedded memory in a single commercial-grade Stratix V GX FPGA package, making it well suited for complex programmable hardware tasks that demand on-chip resources and broad I/O. Its low core voltage range and family-level transceiver capabilities (varying by speed grade) offer designers options for optimizing power and high-speed serial interfaces as defined in the Stratix V GX series documentation.

Manufactured by Intel and documented within the Stratix V device datasheet, this device is positioned for customers building large-scale programmable systems that require consolidation of logic, memory, and I/O into a single FPGA solution.

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