5SGXEBBR2H43C2LN

The 5SGXEBBR2H43C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) IC offering very high logic capacity, abundant on‑chip memory, and a large I/O count in a 1760‑ball BGA package. Designed for commercial‑grade systems, this device targets complex digital integration where large logic, substantial embedded RAM, and extensive external interfacing are required.

As a Stratix V GX family device, it is suited for applications that demand high functional density and significant system I/O while operating within standard commercial temperature and power envelopes.

Key Features

• High Logic Capacity — 952,000 logic elements (logic cells) to implement large, complex designs and consolidate multiple functions into a single device.
• Substantial Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM to support wide buffering, deep FIFOs, and memory‑intensive logic.
• Extensive I/O — 600 I/O pins for broad external device interfacing and high‑pin‑count system connectivity.
• Package and Mounting — 1760‑BBGA (FCBGA) package, supplier package listed as 1760‑HBGA (45×45); surface‑mount construction for high‑density PCB integration.
• Core Supply — Core voltage specified from 820 mV to 880 mV, enabling operation within defined low‑voltage core rails.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• High‑capacity digital systems — Implement large FPGA designs where hundreds of thousands of logic elements and significant embedded RAM are required on a single device.
• Systems with heavy I/O requirements — Use in designs that require many parallel interfaces, board‑level bus connections, or numerous control and status signals.
• Transceiver and high‑speed logic subsystems — Appropriate for Stratix V GX‑class designs that leverage high logic density together with device transceiver capabilities described for the family.

Unique Advantages

• Large single‑device integration: 952,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system architecture.
• Generous on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports substantial buffering and local data storage, lowering external memory dependency.
• High I/O count: 600 I/Os provide flexibility to connect numerous peripherals, sensors, and high‑pin‑count interfaces without extra bridging components.
• Commercial reliability: Rated for 0 °C to 85 °C operation to match standard commercial product requirements and deployment scenarios.
• Compact BGA packaging: 1760‑ball BGA (45×45 supplier package) enables dense PCB layouts while supporting surface‑mount assembly processes.
• Environmental compliance: RoHS compliance supports environmentally regulated product lines and sourcing requirements.

Why Choose 5SGXEBBR2H43C2LN?

The 5SGXEBBR2H43C2LN delivers a combination of high logic density, substantial embedded memory, and extensive I/O in a commercial‑grade Stratix V GX device. It is positioned for engineers building complex, integration‑heavy systems that require consolidating large designs into a single FPGA footprint with predictable commercial operating limits.

With defined core voltage range and RoHS compliance, this device provides verifiable electrical and environmental characteristics that support reliable product development cycles and procurement for commercial deployments.

If you would like pricing, availability, or to request a formal quote for 5SGXEBBR2H43C2LN, submit your request and our team will respond with next‑step details and lead‑time information.