5SGXEBBR1H43I2N

The 5SGXEBBR1H43I2N is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It provides substantial programmable logic capacity together with large embedded memory and a high count of I/O to support dense digital designs.

This device targets applications that require high-density logic, on‑chip memory, and extensive I/O, delivered in a surface‑mount FCBGA/HBGA package with industrial operating temperature and RoHS compliance.

Key Features

• Programmable Logic — 952,000 logic elements for implementing large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 53.25 Mbits of embedded memory (53,248,000 bits) to support buffering, FIFOs, and on-chip data storage.
• I/O Capacity — 600 I/Os to connect to a wide range of external devices, buses, and interfaces.
• Package & Mounting — 1760-BBGA (FCBGA) package case; supplier device package listed as 1760-HBGA (45×45). Surface mount construction for PCB assembly.
• Power — Core voltage supply range of 870 mV to 930 mV for core power planning and board-level power budgeting.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Standards & Compliance — RoHS compliant.
• Family-Level Technical Coverage — Part of the Stratix V GX family described in the device datasheet, which documents electrical, switching, I/O timing, and transceiver-related characteristics for this device family.

Typical Applications

• High‑density digital processing — Large logic capacity and significant embedded memory enable complex datapath and compute implementations.
• High‑speed serial and I/O systems — Large I/O count supports designs that require extensive external connectivity and serialized interfaces.
• Industrial systems — Industrial-grade temperature range (−40 °C to 100 °C) makes the device suitable for control and automation equipment operating in harsh environments.

Unique Advantages

• Large programmable capacity: 952,000 logic elements provide the headroom for complex, multi‑lane logic designs without immediate migration.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependency on external memory for buffering and packet storage.
• High I/O density: 600 I/Os simplify system integration by reducing external interface multiplexing and glue logic.
• Industrial reliability: Rated from −40 °C to 100 °C, the device supports extended‑temperature deployments common in industrial applications.
• Package options for surface mount assemblies: 1760‑BBGA (FCBGA) / 1760‑HBGA (45×45) packaging supports compact board layouts and automated assembly.
• Controlled core voltage range: 870 mV to 930 mV core supply range aids predictable power design and system validation.

Why Choose 5SGXEBBR1H43I2N?

The 5SGXEBBR1H43I2N delivers a combination of high logic capacity, considerable embedded memory, and a broad I/O complement in an industrial-grade Stratix V GX FPGA package. Its electrical and switching characteristics are documented as part of the Stratix V family, enabling engineering teams to plan power, timing, and thermal solutions with reference to the device datasheet.

This device is well suited to engineers and system designers building dense, high‑I/O digital systems that require robust on‑chip resources and industrial temperature performance. The package and supply characteristics support compact board integration and controlled power sequencing during development and production.

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