5SGXEBBR1H43C2LG

The 5SGXEBBR1H43C2LG is a Stratix® V GX FPGA IC from Intel, presented in a 1760-BBGA (FCBGA) package with a supplier package of 1760-HBGA (45×45). This commercial-grade device provides a large logic fabric with 952,000 logic elements and approximately 53 Mbits of embedded memory, targeting designs that require high on-chip logic and memory capacity.

With 600 user I/Os, a surface-mount package, and a core voltage supply window of 820 mV to 880 mV, this device is specified for commercial operating conditions (0 °C to 85 °C) and is RoHS compliant.

Key Features

• Core Logic  952,000 logic elements for high-density programmable logic integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffering and memory-intensive functions.
• I/O Capacity  600 user I/Os to accommodate complex interfacing and high-pin-count system designs.
• Power Supply  Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), surface-mount mounting type for PCB assembly.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic  Implement large-scale digital logic, custom compute blocks, and complex state machines using the device’s extensive logic resources.
• Memory-intensive acceleration  Use the approximately 53 Mbits of embedded RAM for buffering, packet processing, and local data storage within FPGA-based accelerators.
• High-pin-count system integration  Leverage 600 I/Os to connect multiple peripherals, high-speed interfaces, and board-level subsystems.

Unique Advantages

• Large logic capacity: 952,000 logic elements provide substantial on-chip programmability for complex designs.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for many applications.
• High I/O density: 600 I/Os simplify integration with multi-interface systems and dense board-level designs.
• Compact, manufacturable package: 1760-BBGA (FCBGA) / 1760-HBGA (45×45) surface-mount package supports modern PCB assembly processes.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match commercial deployment requirements.
• RoHS compliance: Environmentally compliant for global commercial applications.

Why Choose 5SGXEBBR1H43C2LG?

The 5SGXEBBR1H43C2LG offers a combination of very large logic capacity, substantial embedded memory, and a high I/O count in a manufacturable 1760-BBGA surface-mount package. It is positioned for commercial designs that need dense programmable logic and local memory in a single FPGA device while operating within a standard commercial temperature range.

Designers and procurement teams looking for a Stratix® V GX series device with clear, verifiable specifications for logic resources, on-chip RAM, I/O count, supply range, and package details will find this part suitable for scalable, memory- and I/O-heavy applications.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEBBR1H43C2LG Stratix® V GX FPGA.