5SGXEB9R3H43I4G

The 5SGXEB9R3H43I4G is a Stratix® V GX field-programmable gate array (FPGA) IC offering high logic density and extensive on-chip memory in a 1760-BBGA FCBGA package. This industrial-grade device provides a combination of large logic resources, significant embedded RAM, and up to 600 general-purpose I/Os for demanding system designs.

Targeted at applications that require substantial logic capacity and I/O connectivity while maintaining industrial temperature operation, the device delivers a platform-level resource set for complex digital processing and system integration.

Key Features

• Core Logic and LUT Resources  840,000 logic elements and approximately 317,000 logic array blocks (LABs) provide extensive programmable logic capacity for large-scale designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, packet processing, and deep on-chip storage.
• I/O Density  Up to 600 I/Os to support broad interfacing needs across peripherals, buses, and custom I/O networks.
• Package and Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45 × 45), supplied for surface-mount assembly.
• Power  Core supply range of 820 mV to 880 mV to match system power-rail requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for systems requiring industrial-grade thermal performance.
• Compliance  RoHS-compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and on-chip RAM for DSP, packet processing, and complex control algorithms.
• Network and communications systems  Combine high I/O count with the Stratix V GX architecture for demanding protocol handling and multi‑lane interfacing.
• Industrial control and automation  Industrial temperature rating and robust I/O make this FPGA suitable for factory automation, motion control, and instrumentation systems.

Unique Advantages

• High logic capacity: 840,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 53.25 Mbits of RAM supports on-chip buffering and state storage, minimizing external memory requirements.
• Extensive I/O availability: Up to 600 I/Os provide flexibility for dense external interfacing and multi-protocol connectivity.
• Industrial thermal range: Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact BGA packaging: 1760-BBGA FCBGA packaging enables high pin-count solder-down integration for space-constrained PCBs.
• Regulatory readiness: RoHS compliance simplifies integration in environmentally constrained supply chains.

Why Choose 5SGXEB9R3H43I4G?

The 5SGXEB9R3H43I4G positions itself as a high-density Stratix V GX FPGA option for designers who need a large programmable fabric, substantial embedded memory, and broad I/O capacity in an industrial-temperature, surface-mount package. Its combination of 840,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and 600 I/Os makes it suitable for consolidating complex system functions onto a single device.

Backed by the Stratix V device documentation, this FPGA is a practical choice for teams building scalable, robust digital systems that require significant integration and long-term manufacturability in industrial environments.

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