5SGXEB9R3H43I3LN

The 5SGXEB9R3H43I3LN is an Intel Stratix® V GX field programmable gate array offered in an industrial-grade temperature range and a 1760-ball BGA (FCBGA) package. It provides a high-density programmable fabric suitable for complex digital systems that require large on-chip memory and extensive I/O capability.

Designed for applications demanding significant logic capacity and embedded memory, this device delivers a combination of 840,000 logic elements, approximately 53.248 Mbits of embedded RAM, and up to 600 general-purpose I/O pins in a surface-mount 1760-HBGA (45×45) footprint.

Key Features

• Core & Logic — 840,000 logic elements enabling large-scale digital integration for complex algorithms and design partitioning.
• Logic Block Density — 317,000 logic blocks for structured resource allocation across your design.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support large buffers, FIFOs, and storage for data-path and control logic.
• I/O Capacity — Up to 600 user I/O pins to interface with high-pin-count systems and dense connector architectures.
• Power — Core voltage supply specified from 820 mV to 880 mV for defined power domains and system power budgeting.
• Package & Mounting — 1760-BBGA (FCBGA) package, supplier package listed as 1760-HBGA (45×45); surface-mount for modern PCB assembly flows.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance — RoHS-compliant for environmental and regulatory consistency in product designs.

Typical Applications

• High-performance networking — Use the high logic and memory capacity to implement packet processing, switching fabrics, and protocol acceleration.
• Telecommunications infrastructure — Implement complex fronthaul/backhaul functions and large buffering with abundant on-chip RAM and extensive I/O.
• Data center and compute acceleration — Offload compute kernels and hardware-accelerated functions using large programmable fabric and memory resources.
• Test & measurement systems — Support large-channel I/O and real-time data capture/processing in industrial measurement equipment.

Unique Advantages

• Substantial logic capacity: 840,000 logic elements provide room for large designs and multi-function integration on a single device, reducing system BOM.
• Significant embedded memory: Approximately 53.248 Mbits of RAM reduces dependence on external memory, simplifying board layout and improving data throughput.
• High I/O count: 600 I/O pins enable direct interfacing to numerous peripherals, sensors, and high-speed connectors without external multiplexing.
• Industrial temperature rating: −40 °C to 100 °C operation ensures suitability for demanding environmental conditions.
• Compact high-density package: 1760-ball FCBGA (45×45) balances high integration with a standard surface-mount assembly profile suitable for modern PCBs.
• Controlled core voltage: Defined 820 mV–880 mV supply range aids in predictable power design and thermal planning.

Why Choose 5SGXEB9R3H43I3LN?

The 5SGXEB9R3H43I3LN pairs a high-density Stratix V GX architecture with substantial embedded memory and expansive I/O capability for demanding digital systems. Its industrial temperature rating and RoHS compliance make it appropriate for long-life, environmentally-challenging deployments requiring robust, high-capacity programmable logic.

This FPGA is well suited for engineers building complex networking, telecom, and compute-acceleration hardware who need scalable logic resources, large on-chip RAM, and a compact high-ball-count package to minimize board complexity while maximizing system integration.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEB9R3H43I3LN for your next high-density FPGA design.