5SGXEB9R3H43I3N

The 5SGXEB9R3H43I3N is a Stratix V GX field-programmable gate array (FPGA) device supplied in a 1760-BBGA FCBGA package. It provides high logic density and on-chip memory suitable for industrial-grade applications that require large programmable logic capacity, extensive I/O, and operation across a wide temperature and low-voltage core range.

As a Stratix V GX family device, it is part of a series with high-performance transceiver options (series-level characteristics referenced in the device datasheet). This part is intended for designs that need significant embedded memory and a high count of general-purpose I/O in a surface-mount, ball-grid package.

Key Features

• Core Logic — Approximately 840,000 logic elements and 317,000 reported logic blocks provide substantial capacity for complex, high-density designs.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffering, packet processing, and data-path implementations.
• I/O Density — 600 user I/Os to accommodate wide parallel interfaces and high pin-count system integration.
• Power and Voltage — Core voltage operation specified between 820 mV and 880 mV for low-voltage core power domains.
• Package — 1760-BBGA (FCBGA) supplier package 1760-HBGA (45×45) in a surface-mount footprint for board-level integration.
• Operating Range — Industrial-grade temperature range from –40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS‑compliant manufacturing status.
• Series-Level Transceiver Capability — The Stratix V GX family (series-level information) includes transceiver options up to multi‑Gbps speeds as documented in the device series datasheet.

Typical Applications

• High‑performance signal processing — Large logic and embedded memory enable implementation of complex DSP pipelines and real‑time data processing algorithms.
• Network and communications infrastructure — High I/O count and series-level high-speed transceiver options support packet processing, protocol bridging, and line-card designs.
• Data path acceleration — Use the device’s logic density and on-chip RAM for custom data-plane acceleration in network and compute systems.
• Industrial control and instrumentation — Industrial temperature rating and robust I/O make it suitable for control systems, high-channel-count measurement, and automation equipment.

Unique Advantages

• High logic capacity: Approximately 840,000 logic elements allow consolidation of complex functions onto a single device, reducing BOM and board area.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM supports large buffers, lookup tables, and data staging without external memory overhead.
• Extensive I/O options: 600 I/Os provide flexibility for parallel interfaces, wide buses, and high-pin-count system connectivity.
• Industrial temperature capability: Rated from –40 °C to 100 °C for reliable operation in temperature‑sensitive deployments.
• Low-voltage core operation: Core supply specified from 820 mV to 880 mV to match low-voltage system designs and power-optimization strategies.
• RoHS compliant: Manufactured to RoHS standards for regulatory alignment in many global markets.

Why Choose 5SGXEB9R3H43I3N?

The 5SGXEB9R3H43I3N delivers a combination of high logic density, significant on-chip memory, and a large number of I/Os in a 1760-ball FCBGA package suitable for industrial applications. Its specifications make it a strong candidate for designs that require consolidating complex functions, accelerating data paths, or integrating broad interface support while operating across a wide temperature range.

Designed as part of the Stratix V GX family, this device benefits from the broader series’ documented electrical and transceiver characteristics (series-level information available in the datasheet), offering designers a scalable option for high-performance FPGA deployments backed by established device documentation.

Request a quote or submit a sales inquiry to obtain pricing and availability for 5SGXEB9R3H43I3N and to discuss how this FPGA can fit your project requirements.