5SGXEB9R3H43I4N

The 5SGXEB9R3H43I4N is a Stratix V GX family Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-BBGA (FCBGA) package. It provides high logic density and substantial on-chip memory in an industrial-grade, surface-mount form factor for demanding embedded designs.

With 840,000 logic elements, approximately 53.25 Mbits of embedded RAM and 600 I/Os, this device targets designs that require dense logic integration, extensive memory resources, and flexible I/O. Electrical operating parameters include a core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  840,000 logic elements suitable for large-scale programmable logic implementations and complex digital functions.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Capacity  600 general-purpose I/Os to support wide parallel interfaces, peripheral connectivity and system-level integration.
• Power and Voltage  Core supply operating range of 820 mV to 880 mV for defined power delivery and core performance.
• Package & Mounting  1760-BBGA (FCBGA) supplier device package 1760-HBGA (45×45), surface-mount for compact, high-density PCB designs.
• Temperature Grade  Industrial grade with an operating temperature specification from −40 °C to 100 °C for use in temperature-demanding environments.
• Standards Compliance  RoHS compliant for environmental and material compliance in modern electronics manufacturing.

Typical Applications

• High-speed serial and transceiver-based systems  Use the Stratix V GX family device in designs requiring extensive I/O and transceiver-capable architectures for network and communication equipment.
• Complex digital signal processing  Large logic capacity and substantial on-chip RAM enable implementation of DSP chains, packet processing, and algorithm acceleration.
• Industrial control and automation  Industrial temperature rating and broad I/O count suit factory automation, motor control platforms, and process-control systems.
• System integration and prototyping  High integration of logic, memory and I/O simplifies consolidation of multiple functions into a single programmable device for system-level validation and development.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity to implement complex state machines, custom accelerators and large datapaths without partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces external memory needs and lowers system BOM for buffer- and memory-heavy designs.
• Extensive I/O count: 600 I/Os give flexibility to interface to wide buses, multiple peripherals and parallel sensors or actuators directly.
• Industrial temperature range: Rated from −40 °C to 100 °C, enabling deployment in temperature-challenging operational environments.
• Compact, manufacturable package: 1760-BBGA (FCBGA) surface-mount package supports dense PCB layouts while maintaining robust mechanical and thermal characteristics.
• Regulatory-friendly materials: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEB9R3H43I4N?

The 5SGXEB9R3H43I4N Stratix V GX FPGA blends very high logic capacity, significant on-chip memory and a large I/O complement in an industrial-grade, surface-mount package. Its defined core voltage window and extended operating temperature make it suitable for complex, long-lived deployments where density and reliability are key.

This device is well suited to engineering teams designing network infrastructure, industrial automation, advanced DSP systems or consolidated system-on-FPGA implementations that require scalable logic, embedded memory and broad connectivity while meeting RoHS material requirements.

Request a quote or submit your design inquiry for 5SGXEB9R3H43I4N to obtain pricing and availability information tailored to your project needs.