5SGXEBBR1H43C2G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 1,343 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEBBR1H43C2G – Stratix® V GX FPGA, 952000 logic elements

The 5SGXEBBR1H43C2G is a Stratix V GX field programmable gate array (FPGA) IC from Intel, offered in a 1760-BBGA FCBGA package. This high-density FPGA integrates a large programmable fabric with extensive I/O and significant on-chip RAM to support complex digital designs and transceiver-enabled systems.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory and up to 600 I/Os, this device targets applications that require high logic capacity, abundant memory, and flexible interfacing while operating within commercial temperature and voltage ranges.

Key Features

  • Core Logic 
    952,000 logic elements provide substantial programmable fabric for complex combinational and sequential logic, custom processing blocks, and system-level integration.
  • Embedded Memory 
    Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms without external memory dependence.
  • I/O Density 
    Up to 600 general-purpose I/Os for broad interfacing options to peripherals, mezzanine cards, and board-level interconnects.
  • Power and Core Supply 
    Core voltage supply range of 870 mV to 930 mV, enabling operation at the device’s specified core power levels.
  • Package & Mounting 
    1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting for standard board assembly.
  • Operating Grade & Temperature 
    Commercial grade device rated for 0 °C to 85 °C operation.
  • Compliance 
    RoHS compliant for material and environmental conformance.

Typical Applications

  • High-density digital systems 
    Large logic capacity and embedded RAM make this device suitable for complex control logic, algorithm acceleration, and custom processing pipelines.
  • Communications and transceiver-enabled systems 
    As a Stratix V GX family device, it supports the series’ transceiver capabilities and is appropriate for designs that leverage high-speed serial interfaces and multi-gigabit links.
  • Data buffering and packet processing 
    Generous on-chip memory and high I/O counts enable buffering, packet handling, and real-time data-path implementations.

Unique Advantages

  • High logic integration: 952,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying system design and lowering bill-of-materials complexity.
  • Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports large local storage for low-latency data processing and reduces external memory bandwidth requirements.
  • Extensive I/O capability: Up to 600 I/Os provide flexibility for dense board-level connectivity and multiple peripheral interfaces without additional bridge components.
  • Commercial temperature rating: Rated 0 °C to 85 °C for mainstream commercial applications, aligning with standard electronics deployment environments.
  • Industry-standard packaging: 1760-BBGA FCBGA footprint with surface-mount compatibility for established PCB assembly processes.
  • Regulatory and environmental compliance: RoHS compliance supports regulatory requirements for a wide range of product markets.

Why Choose 5SGXEBBR1H43C2G?

This Stratix V GX FPGA balances very high logic density, substantial embedded memory, and broad I/O capacity in a single commercial-grade FCBGA package. It is well suited for engineers designing complex digital systems, communication platforms that make use of Stratix V GX transceivers, and applications requiring large on-chip storage and extensive connectivity.

Choosing 5SGXEBBR1H43C2G offers a scalable foundation for designs where programmable logic, embedded RAM, and I/O density drive system capability—backed by Intel’s Stratix V family documentation and device-level electrical and switching characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEBBR1H43C2G. Our team can provide lead-time details and support for your procurement and design planning.

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