5SGXEBBR1H43C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 828 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEBBR1H43C2N – Stratix® V GX FPGA, 952,000 logic elements, 600 I/Os
The 5SGXEBBR1H43C2N is a Stratix® V GX field-programmable gate array (FPGA) IC offering very high logic density and extensive I/O connectivity in a 1760-BBGA (45×45) FCBGA package. It integrates a large pool of programmable logic and embedded RAM to address demanding, high-density logic and I/O designs.
Designed for commercial temperature operation, this device delivers approximately 53.25 Mbits of on-chip RAM and 952,000 logic elements, making it suitable for advanced communications, compute acceleration, and other applications that require substantial on-chip memory and parallel logic resources.
Key Features
- Core Logic 952,000 logic elements provide a high-capacity programmable fabric for complex logic, parallel processing, and custom datapaths.
- Embedded Memory Approximately 53.25 Mbits of total on-chip RAM to support buffering, packet processing, and large state machines without external memory.
- I/O Density 600 I/O pins to enable extensive peripheral, signaling, and interface connectivity on dense multi-channel designs.
- Transceiver-Class Device Family Part of the Stratix V GX family; datasheet content covers electrical and switching characteristics including transceiver specifications and I/O timing for high-performance interfaces.
- Power and Voltage Core voltage supply range specified at 870 mV to 930 mV, supporting core-power planning and power-supply design.
- Package & Mounting 1760-BBGA (FCBGA) supplier package 1760-HBGA (45×45) in a surface-mount form factor for high-density PCB assembly.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to meet standard commercial-environment requirements.
- RoHS Compliant Meets RoHS requirements for restricted substances.
Typical Applications
- High-Speed Communications Leverages the Stratix V GX family transceiver-focused architecture and high I/O count for multi-channel serial and parallel communication systems.
- Compute Acceleration Large logic capacity and substantial on-chip RAM support hardware acceleration of dataplane processing and custom compute kernels.
- Network & Packet Processing On-chip memory and abundant I/Os enable buffering, packet inspection, and complex forwarding logic without immediate reliance on external memory.
- Advanced Prototyping High-density programmable fabric facilitates system-level prototyping where logic capacity, I/O variety, and embedded RAM are primary requirements.
Unique Advantages
- High Logic Density: 952,000 logic elements allow implementation of large-scale custom logic and parallel datapaths, reducing the need for multi-chip partitioning.
- Substantial On-Chip Memory: Approximately 53.25 Mbits of embedded RAM supports large buffers and state storage to simplify board-level memory architectures.
- Extensive I/O Capability: 600 I/Os enable flexible interfacing with numerous peripherals, lanes, and control signals on a single device.
- Compact, Surface-Mount Package: The 1760-BBGA (45×45) FCBGA package delivers high integration density for space-constrained, high-performance PCBs.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation for deployment in standard commercial environments.
- Regulatory Compliance: RoHS compliance supports use in designs targeting restricted-substance regulations.
Why Choose 5SGXEBBR1H43C2N?
The 5SGXEBBR1H43C2N combines very high logic capacity, significant embedded RAM, and broad I/O support in a single Stratix V GX FPGA package to address complex designs that require on-chip parallelism and memory. Its electrical characteristics and transceiver-focused family-level documentation make it a solid choice for applications where dense programmable logic and extensive I/O are key design drivers.
This device is well suited to engineering teams developing high-density communications, compute acceleration, and advanced prototyping projects that benefit from a scalable FPGA platform backed by Stratix V series technical documentation.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional technical information for the 5SGXEBBR1H43C2N.

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