5SGXEBBR2H43C2G

The 5SGXEBBR2H43C2G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, offered in a 1760-BBGA (FCBGA) package. It delivers a large on-chip logic capacity and substantial embedded memory for high-density, programmable system designs.

With 952,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 user I/O, this commercial-grade device is intended for designs that require extensive logic resources, abundant I/O, and platform-level configurability while operating at a core supply voltage of 870 mV to 930 mV and a commercial temperature range.

Key Features

• Large Logic Capacity — 952,000 logic elements to support complex, high-gate-count designs and extensive programmable logic fabric.
• Embedded Memory — Approximately 53 Mbits of on-chip RAM for buffering, lookup tables, and data-intensive processing.
• Rich I/O — 600 user I/O pins to accommodate dense interfacing and wide external connectivity.
• Package and Mounting — 1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45); surface-mount mounting type for PCB integration.
• Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power specifications.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance — RoHS compliant.
• Stratix V GX Family Characteristics — Part of the Stratix V GX family, which includes transceiver speed-grade options as described in the Stratix V device documentation.

Typical Applications

• High-density logic systems — Use the large logic element count and on-chip RAM to implement complex, multi-function programmable logic designs.
• Connectivity and interface aggregation — 600 I/O pins enable designs requiring extensive external device interconnects and parallel interfaces.
• Prototyping and platform development — The combination of logic resources and embedded memory supports system-level prototyping and platform consolidation.

Unique Advantages

• Massive programmable fabric: 952,000 logic elements provide capacity for large, multi-domain designs without immediate partitioning across devices.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduces reliance on external memory for many buffering and data-path requirements.
• High I/O density: 600 user I/O pins facilitate broad external connectivity and parallel data routing on a single device.
• Compact, production-ready package: 1760-BBGA / 1760-HBGA (45×45) package in a surface-mount form factor supports dense PCB layouts and assembly processes.
• Commercial operating range: Rated 0 °C to 85 °C for standard commercial deployments while meeting RoHS environmental requirements.
• Vendor-backed family documentation: Part of the Stratix V GX family with detailed electrical and switching characteristics available in the device datasheet.

Why Choose 5SGXEBBR2H43C2G?

The 5SGXEBBR2H43C2G combines a very large logic fabric, substantial embedded memory, and a high I/O count in a production-ready BGA package—making it suitable for demanding commercial FPGA applications where on-chip resources and board-level integration matter. Its commercial temperature rating and RoHS compliance align with standard production environments and regulatory requirements.

Engineers and procurement teams seeking a high-capacity Stratix V GX FPGA for complex system designs will find this part provides the core resources needed for scalable, configurable hardware implementations while leveraging Intel’s Stratix V documentation and support ecosystem.

Request a quote or submit a procurement inquiry to evaluate 5SGXEBBR2H43C2G for your next design project.