5SGXEBBR2H43C2LG

The 5SGXEBBR2H43C2LG is a Stratix® V GX field programmable gate array (FPGA) in a 1760-BBGA (FCBGA) package designed for commercial-grade applications. It delivers high logic density and substantial on-chip memory to support complex digital designs that require large I/O counts and dense embedded resources.

Key Features

• Core Capacity  Provides 952,000 logic elements for implementing large-scale digital designs and complex custom logic functions.
• Embedded Memory  Approximately 53.248 Mbits of embedded memory to support data buffering, on-chip storage, and memory-intensive algorithms.
• I/O Density  600 device I/O pins to facilitate high-pin-count interfaces, parallel buses, and extensive external connectivity.
• Power and Voltage  Core voltage supply range from 820 mV to 880 mV to match system power-rail requirements for this device family.
• Package and Mounting  1760-BBGA (FCBGA) 45 × 45 mm supplier package for surface-mount PCB assembly and high-density board integration.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C, suitable for ambient-controlled commercial applications.
• Compliance  RoHS-compliant manufacturing to meet environmental and supply-chain requirements.

Typical Applications

• High-density digital systems  Implement large custom combinational and sequential logic using 952,000 logic elements for compute- and control-focused designs.
• Embedded memory buffering  Use approximately 53.248 Mbits of on-chip RAM for frame buffers, packet buffering, or temporary data storage without external memory dependency.
• High I/O connectivity  Leverage 600 I/O pins for multi-lane parallel interfaces, broad sensor arrays, or complex peripheral routing on commercial products.
• Commercial product platforms  Deploy in commercial-grade systems that operate within a 0 °C to 85 °C ambient range and require RoHS-compliant components.

Unique Advantages

• High logic density: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 600 I/O pins provide flexibility for complex interface topologies and high-pin-count designs.
• Compact, manufacturable package: 1760-BBGA (FCBGA) in a 45 × 45 mm footprint supports surface-mount assembly for production environments.
• Commercial temperature grading: Rated 0 °C to 85 °C for deployment in standard commercial applications and environments.
• RoHS compliance: Helps meet modern environmental and regulatory requirements for assembled products.

Why Choose 5SGXEBBR2H43C2LG?

The 5SGXEBBR2H43C2LG combines a very high logic element count, substantial embedded RAM, and a large I/O complement in a production-ready FCBGA package, offering a compact solution for dense, feature-rich commercial FPGA designs. Its defined operating voltage range and commercial temperature rating make it suitable for system architectures that prioritize integration and on-chip resources.

This device is well suited to engineering teams designing complex digital systems that require on-chip memory and many I/Os while maintaining RoHS compliance and a commercial operating envelope. The Stratix V GX family datasheet further documents device-level electrical and transceiver characteristics pertinent to system integration and performance validation.

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