5SGXEBBR1H43I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,776 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEBBR1H43I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEBBR1H43I2G is a Stratix V GX family FPGA offering a high-density programmable fabric with integrated multi-gigabit transceiver capabilities as described in the device datasheet. It combines a large number of logic elements, substantial on-chip memory, and a wide I/O complement in a high-pin-count FCBGA package for industrial-grade applications.
Key value propositions include a dense logic resource pool, significant embedded RAM capacity, and extensive I/O and packaging options that suit complex system designs requiring programmable hardware acceleration, high-speed serial links, and robust operating-temperature range.
Key Features
- Logic Capacity Approximately 952,000 logic elements, enabling implementation of large, complex digital designs and system-level integration.
- Embedded Memory Approximately 53.25 Mbits of embedded memory for buffering, packet processing, and on-chip data storage.
- I/O Density 600 user I/O pins to support broad peripheral connectivity and high-pin-count system interfaces.
- Transceiver Capability (Series) Stratix V GX devices include multi-gigabit transceiver speed grades as documented in the Stratix V device datasheet, providing options for high-speed serial communication links.
- Power Supply Core operating voltage range of 870 mV to 930 mV to match system power architectures and allow for controlled core-power design.
- Package and Mounting Supplied in a 1760-BBGA FCBGA package (supplier package 1760-HBGA, 45×45 mm) and designed for surface-mount assembly.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- High-Speed Networking Use the device’s multi-gigabit transceiver capabilities and high I/O count for line cards, switches, and network interface designs that require programmable protocol handling.
- Data Center Acceleration Large logic capacity and substantial embedded memory support hardware acceleration, packet processing, and custom offload engines.
- Industrial Communications Industrial temperature rating and robust I/O make this FPGA suitable for industrial ethernet, gateway, and factory automation interfaces.
- Test & Measurement Dense logic and flexible I/O allow implementation of complex signal processing, pattern generation, and real-time analysis functions.
Unique Advantages
- High logic density: Large logic element count enables consolidation of multiple functions onto a single device, reducing system BOM and board area.
- Significant on-chip RAM: Approximately 53.25 Mbits of embedded memory supports deep buffering and state storage for high-throughput designs.
- Extensive I/O resources: 600 I/Os allow flexible interfacing to high-pin-count peripherals and multiple parallel buses.
- Industrial-rated operation: Specified for −40 °C to 100 °C operation, making it suitable for equipment deployed in demanding environments.
- Package options for dense systems: 1760-BBGA (1760-HBGA supplier package, 45×45 mm) provides a high pin count in a compact footprint for system-level integration.
- Controlled core voltage: 870–930 mV supply range supports power-architecture planning and core power optimization.
Why Choose 5SGXEBBR1H43I2G?
The 5SGXEBBR1H43I2G pairs a high quantity of logic elements with ample embedded memory and a broad I/O complement in a high-pin-count FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life, harsh-environment applications where programmable hardware and high-speed serial connectivity are required.
This device is well suited to system designers building complex communications, data-center acceleration, and industrial control solutions who need scalable logic density, on-chip memory, and extensive interfacing while maintaining controlled power and thermal profiles.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for integrating the 5SGXEBBR1H43I2G into your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018