5SGXEB9R3H43I3LG

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 523 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R3H43I3LG – Stratix® V GX Field Programmable Gate Array (FPGA), 840,000 logic elements

The 5SGXEB9R3H43I3LG is an Intel Stratix® V GX series FPGA in a 1760-BBGA (FCBGA) package, offering very high logic capacity and on-chip memory for complex digital designs. This device provides a dense programmable fabric with a high I/O count and is supplied in an industrial temperature grade for systems requiring extended operating range.

Architected for designs that demand large-scale programmable logic, substantial embedded memory, and broad I/O connectivity, the device supports a low-voltage core supply and robust packaging suitable for demanding embedded and industrial applications.

Key Features

  • High Logic Capacity — 840,000 logic elements to implement large-scale digital functions and complex algorithms.
  • Embedded Memory — Approximately 53.2 Mbits of on-chip RAM (53,248,000 total RAM bits) to support large buffers, FIFOs, and local data storage.
  • I/O Density — 600 I/O pins for extensive external connectivity and high-bandwidth interfacing options.
  • Transceiver Capability (Series) — Stratix V GX family transceiver speed grades are defined in the device series documentation, including GX channel options up to 14.1 Gbps.
  • Power and Voltage — Core supply voltage range of 820 mV to 880 mV for the device core, enabling operation within tightly controlled low-voltage domains.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet extended environmental requirements.
  • Package and Mounting — 1760-BBGA (FCBGA) supplier package 1760-HBGA (45×45); surface-mount device suitable for compact PCB implementations.
  • Standards Compliance — RoHS compliant for regulatory alignment in lead-free assemblies.

Typical Applications

  • High-density signal processing — Deploy the device where large programmable logic and significant embedded RAM are required for data path and DSP implementations.
  • Prototyping and system integration — Use the FPGA for integrating complex digital subsystems with wide I/O counts and flexible interfacing.
  • Industrial control and automation — Leverage the industrial temperature rating and broad I/O complement for control electronics and industrial communication endpoints.

Unique Advantages

  • Substantial programmable fabric — 840,000 logic elements provide headroom to consolidate multiple functions into a single device, reducing system complexity.
  • Large embedded memory — Approximately 53.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
  • Extensive I/O — 600 I/Os enable broad peripheral and interface support without additional bridging logic.
  • Industrial-grade operation — Rated for −40 °C to 100 °C, offering a wide operating range for harsher environments.
  • Low-voltage core operation — Core supply between 820 mV and 880 mV supports designs targeting efficient core power management.
  • RoHS compliant — Aligned with lead-free manufacturing requirements for regulated markets.

Why Choose 5SGXEB9R3H43I3LG?

The 5SGXEB9R3H43I3LG combines very high logic density, substantial embedded memory, and a large I/O complement in a 1760-ball BGA package, making it suitable for complex, high-capacity designs that must operate across an extended temperature range. Its specification set is aligned to engineers building advanced digital systems that require integration of multiple functions into a single programmable device.

As part of the Stratix V GX family, this device benefits from series-level documentation and defined transceiver speed grades, enabling system designers to plan for high-performance I/O and transceiver requirements while maintaining a compact board footprint and RoHS-compliant manufacturing.

Request a quote or submit a procurement inquiry to evaluate how the 5SGXEB9R3H43I3LG can meet your project requirements and to obtain availability and pricing information.

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