5SGXEB9R3H43C4G

The 5SGXEB9R3H43C4G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in a 1760-BBGA (FCBGA) package. It provides high logic density, substantial on-chip memory, and a large I/O count for complex, high-density designs.

This commercial-grade device targets applications that require significant programmable logic, abundant embedded RAM, and extensive external interfacing while operating within a commercial temperature range and a low core-voltage window.

Key Features

• Core Logic  840,000 logic elements for large-scale programmable designs and complex custom logic implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate data storage without relying solely on external memory.
• I/O Capability  600 I/Os to enable wide external connectivity and parallel interfacing with peripherals, memory, and high-pin-count mezzanine modules.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount package suitable for compact, high-density board designs.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail planning and enable low-voltage core operation.
• Operating Temperature  Commercial grade with an operating temperature range of 0°C to 85°C for typical commercial-environment deployments.
• Environmental Compliance  RoHS compliant for alignment with common environmental and manufacturing requirements.

Typical Applications

• High-density logic and custom compute  Implementation of large-scale custom logic functions and hardware accelerators using 840,000 logic elements and substantial embedded RAM.
• High-pin-count interface systems  Systems requiring many external interfaces—such as multi-channel data aggregation or wide parallel buses—can leverage the device’s 600 I/Os.
• Data buffering and on-chip storage  Designs that need significant internal buffering, packet memory, or LUT storage benefit from approximately 53.25 Mbits of embedded memory.
• Commercial networking and compute modules  Commercial-grade deployments where tight integration, dense logic, and controlled operating temperature ranges are required.

Unique Advantages

• Highly integrated logic and memory: Large logic element count paired with substantial embedded RAM reduces dependency on external components and simplifies board-level memory design.
• Extensive external connectivity: 600 I/Os provide flexibility for complex multi-channel interfacing, mezzanine connections, and broad peripheral integration.
• Compact, high-density package: 1760-BBGA (FCBGA) package enables dense PCB implementations while preserving high pin-count access.
• Low-voltage core operation: The 820 mV to 880 mV supply range supports modern low-voltage system architectures and power planning.
• Commercial temperature grade: Rated for 0°C to 85°C operation, suitable for a wide range of commercial products and deployments.
• RoHS compliant: Meets common environmental compliance expectations for manufacturing and procurement.

Why Choose 5SGXEB9R3H43C4G?

The 5SGXEB9R3H43C4G combines very high logic capacity, significant embedded memory, and a large I/O complement in a single commercial-grade Stratix V GX package. It is positioned for engineers and teams building complex programmable systems that require dense on-chip resources and extensive external interfacing while operating within a commercial temperature envelope.

As part of the Stratix V family from Intel, this device provides a solution for scalable designs where board-level integration, on-chip buffering, and high I/O count are prioritized. The combination of package density, low-voltage core range, and RoHS compliance supports practical deployment and manufacturing considerations.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEB9R3H43C4G Stratix V GX FPGA.