5SGXEB9R3H43C3N

The 5SGXEB9R3H43C3N is a Stratix® V GX field programmable gate array (FPGA) from Intel designed for high-density, high-performance logic integration. As a Stratix V GX device it pairs a large logic fabric with on-chip embedded memory and multi-gigabit transceiver capability, delivered in a 1760-ball BGA (FCBGA) package.

This commercial-grade FPGA is targeted at designs requiring substantial on-chip logic, abundant I/O, and integrated memory while operating within standard commercial temperature and supply ranges.

Key Features

• High logic capacity — Provides 840,000 logic elements and 317,000 logic array blocks equivalent, enabling complex digital designs and large FPGA implementations.
• Embedded memory — Approximately 53.2 Mbits of on-chip RAM (53,248,000 bits) for buffering, FIFOs, and embedded data structures.
• Extensive I/O — Up to 600 I/O pins to support dense external connectivity and parallel interfacing.
• Transceiver speed grades — Stratix V GX devices include transceiver options with channel speeds referenced in the family datasheet, including availability up to 14.1 Gbps in certain GX speed grades, and other grades supporting 12.5 Gbps and 8.5 Gbps.
• Power and supply — Core voltage supply range of 820 mV to 880 mV for the device core.
• Commercial operating range — Rated for commercial operation from 0 °C to 85 °C.
• Package and mounting — 1760-ball BGA (FCBGA) package; supplier device package indicated as 1760-HBGA (45 × 45 mm), surface-mount mounting.
• Standards compliance — RoHS compliant.

Typical Applications

• High-speed serial and comms systems — Leverage Stratix V GX transceiver speed grades and extensive I/O for multi-gigabit links and communication endpoints.
• High-density signal processing — Use the large logic element count and ~53.2 Mbits of embedded RAM for DSP, packet processing, and compute-accelerated functions.
• Platform and prototype systems — Ideal where substantial programmable logic, many I/Os, and embedded memory are required within a commercial-temperature design.

Unique Advantages

• Large on-chip resources: 840,000 logic elements and sizable embedded RAM reduce the need for external FPGA fabric or memory, simplifying system BOM.
• High I/O density: 600 I/O pins enable complex board-level interfacing and parallel connectivity without extensive external multiplexing.
• Configurable high-speed links: GX transceiver speed grades documented for the Stratix V family provide options for multi-gigabit channel implementation tied to the device family specifications.
• Commercial-grade thermal profile: Specified for 0 °C to 85 °C operation, matching typical commercial system requirements.
• Compact, surface-mount package: 1760-ball FCBGA (1760-HBGA supplier package, 45 × 45 mm) supports high-density PCB layouts and reliable board assembly.
• Vendor-backed documentation: Device electrical and switching characteristics are covered in the Stratix V device datasheet for design and verification reference.

Why Choose 5SGXEB9R3H43C3N?

The 5SGXEB9R3H43C3N positions itself where substantial programmable logic, ample embedded memory, and extensive I/O are required within a commercial-temperature FPGA solution. Its Stratix V GX lineage provides documented transceiver speed options and detailed electrical characteristics to support performance-driven designs.

Design teams targeting high-density signal processing, multi-gigabit connectivity, or complex programmable platforms will find the combination of logic capacity, embedded RAM, and I/O count useful for consolidating functionality and reducing external components, backed by Intel’s Stratix V documentation.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEB9R3H43C3N to move your design forward.