5SGXEB9R3H43C2LN

The 5SGXEB9R3H43C2LN is a commercial-grade Stratix® V GX field programmable gate array (FPGA) from Intel. It combines 840,000 logic elements with approximately 53.25 Mbits of embedded memory and 600 I/O pins in a high-pin-count 1760-BBGA (FCBGA) surface-mount package.

This device is designed for applications that require large logic capacity, substantial on-chip RAM, and dense external connectivity within a commercial operating temperature range (0 °C to 85 °C). As a member of the Stratix V GX family, the device aligns with the family’s documented transceiver speed-grade capabilities.

Key Features

• Logic Capacity  840,000 logic elements to implement complex digital designs and large-scale logic fabrics.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, packet storage, and algorithm state.
• I/O Density  600 I/O pins to support wide parallel interfaces or multiple serial lanes and peripherals.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier device package listed as 1760-HBGA (45×45), surface-mount for compact, high-pin-count board designs.
• Power Supply  Core voltage range 820 mV to 880 mV to match system power-rail requirements.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Family Transceiver Capability  The Stratix V GX device family provides transceiver speed-grade options (family documented up to 14.1 Gbps depending on speed grade).

Typical Applications

• High-speed serial communications  Leverage the Stratix V GX family transceiver speed-grade options and the device’s 600 I/Os to implement multi-lane serial interfaces and data links.
• Compute and acceleration  Large logic element count and abundant on-chip RAM support custom hardware acceleration and compute-heavy processing tasks.
• I/O-dense systems  600 I/Os enable aggregation of multiple interfaces, protocol bridging, and high-pin-count peripheral integration in compact designs.
• Complex digital prototypes  High logic and memory capacity make the device suitable for prototyping large digital systems and validating system-level architectures.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity for large, feature-rich designs without immediate need to partition across devices.
• Substantial on-chip RAM: Approximately 53.25 Mbits of embedded memory reduces reliance on external memory for intermediate buffering and state storage.
• Extensive I/O: 600 I/O pins simplify integration with multiple external interfaces and parallel buses, reducing board-level complexity.
• Compact, high-pin-count package: 1760-BBGA (FCBGA) in a surface-mount form factor enables dense board layouts with robust signal routing.
• Commercial temperature grade and RoHS compliance: Suitable for mainstream commercial products with environmental compliance for many global markets.

Why Choose 5SGXEB9R3H43C2LN?

The 5SGXEB9R3H43C2LN combines high logic density, significant embedded memory, and extensive I/O in a single commercial-grade Stratix V GX device. Its 1760‑pin BGA package and surface-mount mounting support compact, high-performance board designs that need substantial on-chip resources.

This device is well suited for engineering teams developing I/O-intensive systems, high-throughput data paths, or large-scale digital logic implementations that benefit from the Stratix V GX family capabilities and documented transceiver speed-grade options.

Request a quote or submit a request for pricing and availability to begin evaluating the 5SGXEB9R3H43C2LN for your next design.