5SGXEB9R3H43C2N

The 5SGXEB9R3H43C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a commercial temperature grade. It provides high on-chip logic capacity and memory density in a high-pin-count FCBGA package, making it suitable for complex digital designs that require substantial logic, memory, and I/O resources.

This device combines approximately 840,000 logic elements with about 53.25 Mbits of embedded memory and 600 I/Os, delivering a platform for advanced system integration where high logic density and broad connectivity are required.

Key Features

• Core & Logic  Approximately 840,000 logic elements and roughly 317,000 LABs provide significant programmable fabric for large-scale logic integration.
• On‑chip Memory  Approximately 53.25 Mbits of embedded RAM for buffering, state storage, and on‑chip data processing.
• I/O Capacity  600 general-purpose I/Os to support wide bus interfaces, parallel peripherals, and extensive external connectivity.
• Power  Core supply specified between 870 mV and 930 mV to match low-voltage system designs and power domains.
• Package & Mounting  1760‑BBGA (FCBGA) package; supplier package referenced as 1760‑HBGA (45×45). Surface-mount mounting type for PCB assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Unique Advantages

• High logic density: The combination of ~840k logic elements and ~317k LABs supports large, complex FPGA designs without immediate need for multi‑device partitioning.
• Substantial embedded memory: Approximately 53.25 Mbits of on‑chip RAM reduces external memory dependency for many buffering and caching applications.
• Extensive I/O availability: 600 I/Os enable broad external device interfacing and multi‑lane parallel connections directly to the FPGA fabric.
• Compact, high‑pin package: 1760‑BBGA/1760‑HBGA (45×45) packaging consolidates high I/O and dense logic into a single, surface‑mount footprint suitable for space-constrained PCBs.
• Designed for commercial systems: Commercial temperature grade (0 °C to 85 °C) aligns the device to mainstream embedded and communications products.
• RoHS compliance: Meets common lead‑free and hazardous substance requirements for modern electronics manufacturing.

Why Choose 5SGXEB9R3H43C2N?

5SGXEB9R3H43C2N positions itself for designers who need a high‑capacity Stratix V GX FPGA with large logic and memory resources plus extensive I/O in a single device. Its combination of approximately 840,000 logic elements, about 53.25 Mbits of embedded RAM, and 600 I/Os supports complex digital signal processing, large control systems, and dense interfacing requirements while maintaining a compact FCBGA package footprint.

For teams focused on scalable design, system consolidation, and mainstream commercial deployments, this Stratix V GX device delivers measurable integration advantages with vendor‑specified operating parameters and RoHS compliance to support production-ready assemblies.

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