5SGXEB9R3H43C3G

The 5SGXEB9R3H43C3G is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1760-BBGA FCBGA package. It provides a high-density programmable fabric, large on-chip memory, and a high I/O count for complex digital systems and board-level integration.

Designed for commercial temperature operation, this device targets designs that require substantial logic capacity, extensive external connectivity, and a low-voltage core operating range to support modern power-optimized systems.

Key Features

• Programmable Logic  Approximately 840,000 logic elements for implementing large-scale logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 53.25 Mbits of embedded memory to support buffers, FIFOs, and on-chip storage for high-throughput designs.
• I/O Capacity  600 user I/Os providing extensive external connectivity for multi-channel interfaces and peripheral integration.
• Package & Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type for PCB assembly.
• Power and Core Voltage  Core voltage supply range from 820 mV to 880 mV to match low-voltage power domains and optimized core power delivery.
• Temperature Grade  Commercial operating temperature range 0 °C to 85 °C for standard electronics and commercial-grade applications.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assemblies.

Typical Applications

• High-density logic designs  Implement large custom logic blocks, complex control systems, and deep datapaths using the device’s high logic element count and on-chip memory.
• High-pin-count interfaces  Use the 600 I/Os to connect multiple external peripherals, parallel interfaces, and board-level subsystems without additional bridging devices.
• On-chip buffering and data handling  Leverage approximately 53.25 Mbits of embedded memory for packet buffering, streaming FIFOs, and temporary data storage.
• Commercial electronic systems  Deploy in products and prototypes that operate within the commercial temperature range and require RoHS-compliant components.

Unique Advantages

• Large programmable fabric: 840,000 logic elements reduce the need for multiple FPGAs or external ASICs in many high-complexity designs.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM minimizes external memory dependencies and lowers system BOM complexity.
• Extensive external connectivity: 600 I/Os enable direct interfacing to numerous peripherals and parallel buses, simplifying board-level integration.
• Compact, assembly-ready package: 1760-BBGA FCBGA packaging with surface-mount mounting supports automated PCB assembly and dense board layouts.
• Low-voltage core operation: Core voltage range of 820 mV–880 mV aligns with modern power-optimized designs and supply architectures.
• Regulatory-friendly: RoHS compliance helps meet environmental and manufacturing requirements for commercial products.

Why Choose 5SGXEB9R3H43C3G?

The 5SGXEB9R3H43C3G combines a very large logic capacity with substantial embedded memory and a high I/O count in a single commercial-grade FPGA package. These characteristics make it well suited for complex, board-level digital designs that require programmable flexibility, on-chip buffering, and extensive connectivity while operating within standard commercial temperature ranges.

Designed and supplied by Intel as part of the Stratix V GX family, this device offers a balance of integration and capacity for teams building scalable prototypes, advanced proof-of-concept systems, and production designs that prioritize high logic density and memory-rich architectures.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the 5SGXEB9R3H43C3G and to discuss how this device can meet your project requirements.