5SGXEB9R3H43I3G

The 5SGXEB9R3H43I3G is an Intel Stratix® V GX field‑programmable gate array supplied in a 1760‑ball BGA (FCBGA) package. The device integrates 840,000 logic elements and approximately 53.25 Mbits of embedded memory, making it a high‑density FPGA for complex programmable logic implementations.

Designed for industrial‑grade applications, this device provides up to 600 user I/O pins, a low core supply range (0.820–0.880 V), and an operating temperature range of −40 °C to 100 °C. As a member of the Stratix V GX family, the series supports transceiver speed grades referenced in the device datasheet.

Key Features

• Core density  High integration with 840,000 logic elements to implement large custom logic designs and system consolidation.
• Embedded memory  Approximately 53.25 Mbits of on‑chip RAM for buffering, state storage, and memory‑intensive logic functions.
• I/O capability  Up to 600 user I/O pins to support broad interfacing and parallel connectivity needs.
• Transceiver options (series)  Stratix V GX family devices include transceiver speed grades in the datasheet (for example, GX channel listings up to 14.1 Gbps), providing high‑speed serial options at the series level.
• Power  Core supply operating range from 0.820 V to 0.880 V for the FPGA core.
• Package & mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface mount component for standard PCB assembly.
• Industrial temperature grade  Rated for −40 °C to 100 °C operation, suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Deploys where large amounts of programmable logic (840,000 logic elements) and substantial embedded memory (≈53.25 Mbits) are required for consolidation of complex functions.
• I/O‑heavy platforms  Systems that need broad external interfacing can take advantage of up to 600 user I/O pins for parallel and mixed‑signal connectivity.
• Industrial equipment  Suitable for industrial applications that operate across a −40 °C to 100 °C temperature range.
• High‑speed serial systems  As part of the Stratix V GX family, the device aligns with the series’ documented transceiver speed grades for designs requiring high‑speed serial channels.

Unique Advantages

• High logic integration: 840,000 logic elements enable consolidation of multiple functions into a single FPGA to reduce board count and simplify system architecture.
• Significant on‑chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and stateful logic without external memory in many use cases.
• Extensive I/O availability: 600 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and external logic domains.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions.
• Low core voltage operation: Core supply range of 0.820–0.880 V aligns with low‑voltage core requirements for the Stratix V family.
• High‑pin‑count package: 1760‑ball BGA package enables high I/O density in a standard surface‑mount form factor.

Why Choose 5SGXEB9R3H43I3G?

The 5SGXEB9R3H43I3G positions itself as a high‑density Stratix V GX FPGA option for designers needing a large logic fabric, substantial embedded memory, and a high I/O count in an industrial‑rated device. Its combination of 840,000 logic elements, roughly 53.25 Mbits of on‑chip RAM, and up to 600 I/Os makes it suited for complex programmable systems that require consolidation and flexibility.

Choosing this Intel Stratix V GX device delivers a scalable hardware platform backed by the Stratix V series’ documented capabilities, including series transceiver speed grade options and established design support referenced in the device datasheet.

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