5SGXEB9R3H43I3L

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 1,927 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R3H43I3L – Stratix® V GX FPGA, 600 I/O, 840,000 logic elements

The 5SGXEB9R3H43I3L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O applications. This device delivers 840,000 logic elements and approximately 53.25 Mbits of embedded memory, combined with a 600-pin I/O count and Stratix V GX-class architecture.

Specified as an industrial-grade, surface-mount FCBGA package, the device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range of –40°C to 100°C, making it suitable for demanding system-level deployments that require substantial logic capacity and extensive I/O connectivity.

Key Features

  • Core Density  840,000 logic elements and 317,000 logic array blocks (LABs) provide extensive programmable logic capacity for complex designs.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for large buffering, state storage, and implemented tables.
  • I/O Count  600 programmable I/O pins enable wide parallel interfaces and high channel counts.
  • Power / Core Voltage  Operates from a core voltage supply of 820 mV to 880 mV, enabling designs tuned to the device’s specified power domain.
  • Package & Mounting  1760-BBGA, FCBGA package case with supplier device package noted as 1760-HBGA (45×45); surface-mount mounting type supports modern PCB assembly.
  • Industrial Temperature Grade  Rated for operation from –40°C to 100°C for industrial deployment scenarios.
  • Compliance  RoHS compliant.
  • GX-class Transceiver Architecture  Stratix V GX devices include transceiver speed-grade options (refer to the device datasheet for supported speed grades and selections).

Typical Applications

  • High-density digital processing  Large logic element count and abundant on-chip RAM allow implementation of complex signal processing pipelines and custom accelerators.
  • Telecommunications & Networking  High I/O count and Stratix V GX transceiver-class architecture suit wide parallel interfaces and high-channel networking functions.
  • Industrial Control & Automation  Industrial temperature grade and robust packaging support demanding control systems requiring substantial programmable logic and I/O.
  • Data Path and Interface Bridging  Extensive logic and memory resources enable protocol conversion, packet processing, and custom I/O bridging tasks.

Unique Advantages

  • High logic and memory integration: Combines 840,000 logic elements with approximately 53.25 Mbits of embedded RAM to consolidate complex functions into a single device, reducing board-level component count.
  • Large I/O capability: 600 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and high-channel designs without external multiplexing.
  • Industrial-ready thermal range: Specified operation from –40°C to 100°C supports deployment in harsh or temperature-variable environments.
  • Surface-mount FCBGA package: 1760-BBGA / 1760-HBGA (45×45) packaging supports compact system integration and modern PCB assembly processes.
  • Controlled core voltage: Narrow core supply range (820 mV–880 mV) allows precise power delivery planning for optimized performance and reliability.
  • Regulatory compliance: RoHS compliance simplifies environmental and manufacturing compliance efforts.

Why Choose 5SGXEB9R3H43I3L?

The 5SGXEB9R3H43I3L positions itself as a high-density Stratix V GX FPGA option for designs that require a large programmable fabric, significant embedded memory, and extensive I/O. Its industrial temperature rating and robust BGA packaging make it suitable for demanding applications where device-level integration and reliability are priorities.

Engineers and system designers seeking to consolidate complex digital functions, implement large-scale signal processing, or provide broad I/O connectivity will find this device well-suited to scalable, performance-focused designs. Refer to the device datasheet for detailed electrical and transceiver-grade specifications when finalizing system design and board-level integration.

Request a quote or contact sales to discuss availability, pricing, and lead times for the 5SGXEB9R3H43I3L Stratix® V GX FPGA.

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