5SGXEB9R3H43I3L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,927 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB9R3H43I3L – Stratix® V GX FPGA, 600 I/O, 840,000 logic elements
The 5SGXEB9R3H43I3L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O applications. This device delivers 840,000 logic elements and approximately 53.25 Mbits of embedded memory, combined with a 600-pin I/O count and Stratix V GX-class architecture.
Specified as an industrial-grade, surface-mount FCBGA package, the device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range of –40°C to 100°C, making it suitable for demanding system-level deployments that require substantial logic capacity and extensive I/O connectivity.
Key Features
- Core Density 840,000 logic elements and 317,000 logic array blocks (LABs) provide extensive programmable logic capacity for complex designs.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM (53,248,000 bits) for large buffering, state storage, and implemented tables.
- I/O Count 600 programmable I/O pins enable wide parallel interfaces and high channel counts.
- Power / Core Voltage Operates from a core voltage supply of 820 mV to 880 mV, enabling designs tuned to the device’s specified power domain.
- Package & Mounting 1760-BBGA, FCBGA package case with supplier device package noted as 1760-HBGA (45×45); surface-mount mounting type supports modern PCB assembly.
- Industrial Temperature Grade Rated for operation from –40°C to 100°C for industrial deployment scenarios.
- Compliance RoHS compliant.
- GX-class Transceiver Architecture Stratix V GX devices include transceiver speed-grade options (refer to the device datasheet for supported speed grades and selections).
Typical Applications
- High-density digital processing Large logic element count and abundant on-chip RAM allow implementation of complex signal processing pipelines and custom accelerators.
- Telecommunications & Networking High I/O count and Stratix V GX transceiver-class architecture suit wide parallel interfaces and high-channel networking functions.
- Industrial Control & Automation Industrial temperature grade and robust packaging support demanding control systems requiring substantial programmable logic and I/O.
- Data Path and Interface Bridging Extensive logic and memory resources enable protocol conversion, packet processing, and custom I/O bridging tasks.
Unique Advantages
- High logic and memory integration: Combines 840,000 logic elements with approximately 53.25 Mbits of embedded RAM to consolidate complex functions into a single device, reducing board-level component count.
- Large I/O capability: 600 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and high-channel designs without external multiplexing.
- Industrial-ready thermal range: Specified operation from –40°C to 100°C supports deployment in harsh or temperature-variable environments.
- Surface-mount FCBGA package: 1760-BBGA / 1760-HBGA (45×45) packaging supports compact system integration and modern PCB assembly processes.
- Controlled core voltage: Narrow core supply range (820 mV–880 mV) allows precise power delivery planning for optimized performance and reliability.
- Regulatory compliance: RoHS compliance simplifies environmental and manufacturing compliance efforts.
Why Choose 5SGXEB9R3H43I3L?
The 5SGXEB9R3H43I3L positions itself as a high-density Stratix V GX FPGA option for designs that require a large programmable fabric, significant embedded memory, and extensive I/O. Its industrial temperature rating and robust BGA packaging make it suitable for demanding applications where device-level integration and reliability are priorities.
Engineers and system designers seeking to consolidate complex digital functions, implement large-scale signal processing, or provide broad I/O connectivity will find this device well-suited to scalable, performance-focused designs. Refer to the device datasheet for detailed electrical and transceiver-grade specifications when finalizing system design and board-level integration.
Request a quote or contact sales to discuss availability, pricing, and lead times for the 5SGXEB9R3H43I3L Stratix® V GX FPGA.

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