5SGXEB9R3H43C4N

The 5SGXEB9R3H43C4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable fabric paired with substantial on-chip memory and a large I/O count, making it suited to designs that require significant logic capacity and integration in a commercial-temperature environment.

Key capabilities include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 I/Os, delivered in a 1760-ball BGA package with surface-mount assembly.

Key Features

• Core Logic Density — 840,000 logic elements for implementing large-scale programmable logic and complex combinational/sequential functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Capacity — Up to 600 I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense board-level routing.
• Package & Mounting — 1760‑BBGA, FCBGA package; supplier device package listed as 1760‑HBGA (45×45). Surface-mount construction for standard PCB assembly flows.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for device core operation.
• Temperature & Grade — Commercial-grade device with an operating temperature range of 0°C to 85°C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density programmable logic designs — Implement complex state machines, custom accelerators, and large combinational logic using 840,000 logic elements and extensive embedded RAM.
• I/O-intensive systems — Support parallel data paths, multi-channel interfaces, and board-level peripherals with up to 600 I/Os.
• Compact, surface-mount solutions — The 1760‑ball BGA package and surface-mount mounting support space-constrained, high-density PCB layouts.
• Commercial-temperature applications — Designed for systems operating within 0°C to 85°C.

Unique Advantages

• High logic capacity: 840,000 logic elements enable consolidation of multi-function designs into a single device, reducing external component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM minimizes reliance on external memory for buffering and shared storage.
• Large I/O complement: 600 I/Os provide flexibility for interfacing to wide buses, sensors, or parallel peripherals without multiplexing compromises.
• Compact BGA package: The 1760‑BBGA (1760‑HBGA supplier package) supports high pin density in a board-space-efficient form factor.
• Commercial operating range: 0°C to 85°C rating matches typical commercial electronics requirements and system deployment scenarios.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEB9R3H43C4N?

The 5SGXEB9R3H43C4N combines a high-density Stratix V GX FPGA fabric with ample embedded memory and a large I/O footprint in a compact, surface-mount BGA package. It is positioned for engineers who need significant programmable logic and on-chip RAM within a commercial-temperature platform, enabling consolidation of complex functions and reducing system BOM.

This device is appropriate for designs that prioritize integration and board-level density, offering a balance of logic capacity, I/O bandwidth, and package footprint supported by Intel's Stratix V family documentation and electrical characterization.

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