5SGXEB9R3H43C2LG

The 5SGXEB9R3H43C2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, featuring a high-density programmable fabric and a large on-chip memory array. This commercial-grade, surface-mount device delivers 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 600 I/O pins in a 1760-BBGA (FCBGA) package.

As a member of the Stratix V GX family, the device is specified for commercial temperature operation (0 °C to 85 °C) and supports the series’ transceiver speed-grade options documented in the Stratix V device datasheet.

Key Features

• Core Logic  840,000 logic elements provide high-density programmable logic resources for complex FPGA designs.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large data buffers, state machines, and memory‑intensive algorithms.
• I/O Capacity  600 I/O pins for extensive interfacing, permitting multiple parallel interfaces and high pin‑count systems.
• Power Supply  Core voltage supply specified in the 820 mV to 880 mV range for the device core.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier device package 1760-HBGA (45×45), designed for surface-mount PCB assembly.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• RoHS Compliance  RoHS-compliant design suitable for lead‑free manufacturing processes.
• Series Transceiver Capability  Stratix V GX devices are documented in the series datasheet with transceiver speed-grade options (including up to 14.1 Gbps in the series tables).

Typical Applications

• High-density FPGA designs  For systems that require extensive programmable logic and on-chip memory to implement complex algorithms and custom datapaths.
• Multi‑interface systems  Ideal for designs needing large numbers of I/O to connect multiple peripherals, buses, or parallel interfaces.
• Commercial embedded equipment  Targeted at commercial-temperature deployments where a high-capacity FPGA is required in a surface-mount BGA package.
• High-speed serial designs  Suitable within designs leveraging the Stratix V GX series transceiver speed grades documented in the device family datasheet.

Unique Advantages

• High logic density: 840,000 logic elements enable integration of large, complex digital systems into a single FPGA device, reducing board-level component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM supports deep buffering and memory‑intensive processing without external memory.
• Extensive I/O capability: 600 I/O pins provide flexibility to connect numerous external devices and interfaces directly to the FPGA fabric.
• Compact BGA packaging: 1760-BBGA (FCBGA) in a 45×45 supplier package supports high-density PCB layouts and modern surface-mount assembly flows.
• Commercial temperature rating: Rated 0 °C to 85 °C for deployment in commercial‑grade products and systems.
• Standards-compliant materials: RoHS compliance supports lead‑free manufacturing and regulatory requirements.

Why Choose 5SGXEB9R3H43C2LG?

The 5SGXEB9R3H43C2LG brings together a high count of logic elements, substantial embedded memory, and broad I/O capability in a single Stratix V GX package—making it suitable for high-density, commercial FPGA designs that require large programmable resources and extensive interfacing. Its surface-mount 1760-BBGA package enables compact board designs while meeting RoHS requirements.

Engineers selecting this device benefit from a documented device family with defined transceiver speed-grade options and comprehensive electrical characteristics in the Stratix V device datasheet, helping integrate the part into sophisticated commercial systems with predictable operating and power parameters.

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