5SGXEB9R3H43C2G

The 5SGXEB9R3H43C2G is a Stratix V GX family FPGA IC designed for commercial applications requiring high integration of programmable logic, on-chip memory, and dense I/O. As a Stratix V GX device, it provides a large configurable fabric and I/O capability suitable for complex digital functions and transceiver-enabled designs.

Key architectural attributes for this device include 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 I/O pins, offering a balance of logic capacity, embedded RAM, and connectivity for demanding system-level implementations.

Key Features

• Core logic 840,000 logic elements to implement large-scale custom logic and complex datapaths.
• Embedded memory Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and local storage of working datasets.
• I/O density Up to 600 available I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity.
• Power and supply Core voltage range from 870 mV to 930 mV for the device core supply requirements.
• Package and mounting 1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45 × 45 mm) with surface-mount mounting for high-density board designs.
• Operating conditions Commercial temperature grade rated for operation from 0 °C to 85 °C.
• Compliance RoHS compliant to meet common environmental requirements.
• Stratix V family support Family-level documentation covers electrical and switching characteristics, including transceiver and I/O timing information for Stratix V GX devices.

Typical Applications

• High-speed serial and transceiver systems — Leverages the Stratix V GX device family transceiver specifications and high I/O count for designs that require serial link interfaces and protocol bridging.
• Compute and signal processing — Large logic element count and substantial embedded memory allow implementation of complex DSP blocks, packet processing, and custom accelerators.
• I/O-intensive control and aggregation — 600 I/Os provide the connectivity needed for multi-channel data acquisition, aggregation, and board-level interface consolidation.
• Commercial embedded systems — Commercial temperature rating and surface-mount FCBGA packaging make the device suitable for high-density, commercial-grade electronic products.

Unique Advantages

• High integration of logic and memory: 840,000 logic elements combined with approximately 53.25 Mbits of embedded RAM reduce external component needs and simplify board design.
• Large I/O capability: Up to 600 I/Os enable flexible interfacing to multiple peripherals and high-bandwidth external devices.
• Compact, high-density package: 1760-BBGA (1760-HBGA supplier package) provides a compact footprint for complex designs while supporting surface-mount assembly.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial deployment environments.
• Family-level technical documentation: Stratix V device datasheet includes detailed electrical and switching characteristics, including I/O timing and transceiver information to assist design and validation.
• RoHS compliant: Conforms to common environmental and manufacturability requirements.

Why Choose 5SGXEB9R3H43C2G?

The 5SGXEB9R3H43C2G positions itself as a high-capacity, I/O-rich Stratix V GX FPGA for commercial applications that require substantial programmable logic, embedded memory, and extensive board-level connectivity. Its combination of 840,000 logic elements, approximately 53.25 Mbits of on-chip RAM, and up to 600 I/Os makes it suitable for complex signal processing, high-throughput interfacing, and transceiver-enabled designs where integration and density are important.

Supported by Stratix V family documentation detailing electrical characteristics, I/O timing, and transceiver specifications, this device offers a clear technical basis for system architects and engineers evaluating a high-density FPGA solution for commercial-grade products.

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