5SGXEB9R2H43I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,702 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB9R2H43I3LG – Stratix V GX FPGA, 840,000 Logic Elements
The 5SGXEB9R2H43I3LG is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1760-BBGA FCBGA package. It delivers very large programmable logic capacity and extensive I/O in a single industrial-grade device.
With 840,000 logic elements, approximately 53 Mbits of embedded memory, and 600 I/O pins, this device is designed for high-density programmable logic uses where large on-chip resources, high I/O counts, and industrial temperature operation are required.
Key Features
- Core Logic — 840,000 logic elements provide substantial capacity for complex digital designs and large-scale integration on a single FPGA.
- Logic Array Blocks (LABs) — Approximately 317,000 LABs for fine-grained logic structuring and hierarchy.
- Embedded Memory — Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
- I/O Density — 600 general-purpose I/O pins to interface with wide, parallel buses, multiple high-pin-count peripherals, and dense mezzanine connections.
- Power and Core Voltage — Specified core voltage range of 820 mV to 880 mV for modern low-voltage system designs.
- Package — 1760-BBGA FCBGA (supplier package: 1760-HBGA, 45 × 45 mm) for high-pin-count, high-density board designs and surface-mount assembly.
- Temperature and Grade — Industrial-grade device rated for operation from –40°C to 100°C for deployment in demanding environments.
- Standards and Compliance — RoHS compliant.
- Stratix V GX Family Characteristics — As a Stratix V GX device, the family-level datasheet documents GX transceiver speed grades and related electrical characteristics for high-speed channel support as part of the product series.
Typical Applications
- High-density digital processing — Consolidate complex logic, protocol handling, and custom data paths into a single device using large logic and memory resources.
- Networking and communications — Leverage family-level GX transceiver capabilities together with 600 I/Os for high-throughput interfaces and multi-lane I/O architectures.
- Industrial control and automation — Industrial temperature rating and extensive I/O support factory-floor systems, motor control interfaces, and deterministic control logic.
- High-pin-count system integration — Use the 1760-pin BGA package to integrate multiple buses, sensors, and peripherals directly to the FPGA on space-constrained PCBs.
Unique Advantages
- Large integrated logic capacity: 840,000 logic elements reduce the need for multi-FPGA solutions, simplifying board design and lowering BOM complexity.
- Substantial on-chip memory: Approximately 53 Mbits of embedded RAM enables large buffering and local data storage to improve throughput and reduce external memory dependency.
- Extensive I/O connectivity: 600 I/O pins provide flexibility to interface with numerous peripherals and wide parallel buses without external multiplexing.
- Industrial temperature operation: Rated from –40°C to 100°C to support deployment in harsher environments and extended temperature ranges.
- High-density package: 1760-BBGA (1760-HBGA, 45 × 45 mm) supports very high pin counts in a compact surface-mount form factor for modern board layouts.
- Low-voltage core support: Core supply range of 820 mV to 880 mV aligns with low-voltage power architectures common in contemporary systems.
Why Choose 5SGXEB9R2H43I3LG?
The 5SGXEB9R2H43I3LG combines very large logic capacity, significant embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA package. It is well suited to system designs that require consolidation of complex digital functions, dense external interfacing, and reliable operation across a wide temperature range.
Engineers and system designers will find this device appropriate for high-density, high-I/O applications where minimizing component count and maximizing on-chip resources deliver long-term design scalability and robustness. The Stratix V family-level documentation provides additional electrical and transceiver detail for system integration planning.
Request a quote or submit an inquiry today to check availability and pricing for the 5SGXEB9R2H43I3LG and to discuss how it fits your next high-density FPGA design.

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