5SGXEB9R2H43I3LG

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 1,702 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R2H43I3LG – Stratix V GX FPGA, 840,000 Logic Elements

The 5SGXEB9R2H43I3LG is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1760-BBGA FCBGA package. It delivers very large programmable logic capacity and extensive I/O in a single industrial-grade device.

With 840,000 logic elements, approximately 53 Mbits of embedded memory, and 600 I/O pins, this device is designed for high-density programmable logic uses where large on-chip resources, high I/O counts, and industrial temperature operation are required.

Key Features

  • Core Logic — 840,000 logic elements provide substantial capacity for complex digital designs and large-scale integration on a single FPGA.
  • Logic Array Blocks (LABs) — Approximately 317,000 LABs for fine-grained logic structuring and hierarchy.
  • Embedded Memory — Approximately 53 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
  • I/O Density — 600 general-purpose I/O pins to interface with wide, parallel buses, multiple high-pin-count peripherals, and dense mezzanine connections.
  • Power and Core Voltage — Specified core voltage range of 820 mV to 880 mV for modern low-voltage system designs.
  • Package — 1760-BBGA FCBGA (supplier package: 1760-HBGA, 45 × 45 mm) for high-pin-count, high-density board designs and surface-mount assembly.
  • Temperature and Grade — Industrial-grade device rated for operation from –40°C to 100°C for deployment in demanding environments.
  • Standards and Compliance — RoHS compliant.
  • Stratix V GX Family Characteristics — As a Stratix V GX device, the family-level datasheet documents GX transceiver speed grades and related electrical characteristics for high-speed channel support as part of the product series.

Typical Applications

  • High-density digital processing — Consolidate complex logic, protocol handling, and custom data paths into a single device using large logic and memory resources.
  • Networking and communications — Leverage family-level GX transceiver capabilities together with 600 I/Os for high-throughput interfaces and multi-lane I/O architectures.
  • Industrial control and automation — Industrial temperature rating and extensive I/O support factory-floor systems, motor control interfaces, and deterministic control logic.
  • High-pin-count system integration — Use the 1760-pin BGA package to integrate multiple buses, sensors, and peripherals directly to the FPGA on space-constrained PCBs.

Unique Advantages

  • Large integrated logic capacity: 840,000 logic elements reduce the need for multi-FPGA solutions, simplifying board design and lowering BOM complexity.
  • Substantial on-chip memory: Approximately 53 Mbits of embedded RAM enables large buffering and local data storage to improve throughput and reduce external memory dependency.
  • Extensive I/O connectivity: 600 I/O pins provide flexibility to interface with numerous peripherals and wide parallel buses without external multiplexing.
  • Industrial temperature operation: Rated from –40°C to 100°C to support deployment in harsher environments and extended temperature ranges.
  • High-density package: 1760-BBGA (1760-HBGA, 45 × 45 mm) supports very high pin counts in a compact surface-mount form factor for modern board layouts.
  • Low-voltage core support: Core supply range of 820 mV to 880 mV aligns with low-voltage power architectures common in contemporary systems.

Why Choose 5SGXEB9R2H43I3LG?

The 5SGXEB9R2H43I3LG combines very large logic capacity, significant embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA package. It is well suited to system designs that require consolidation of complex digital functions, dense external interfacing, and reliable operation across a wide temperature range.

Engineers and system designers will find this device appropriate for high-density, high-I/O applications where minimizing component count and maximizing on-chip resources deliver long-term design scalability and robustness. The Stratix V family-level documentation provides additional electrical and transceiver detail for system integration planning.

Request a quote or submit an inquiry today to check availability and pricing for the 5SGXEB9R2H43I3LG and to discuss how it fits your next high-density FPGA design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up