5SGXEB9R2H43I3G

The 5SGXEB9R2H43I3G is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. This high-density FPGA integrates 840,000 logic elements and approximately 53.248 Mbits of embedded memory for complex digital designs that require large on-chip resources and high I/O capacity. Designed for surface-mount applications, the device is packaged in a 1760-BBGA FCBGA (1760-HBGA, 45×45) footprint and operates across a wide temperature and core-voltage range.

Key Features

• Core Logic  840,000 logic elements provide large programmable fabric for complex logic, signal processing, and control functions.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffers, FIFOs, and intermediate storage without external memory.
• I/O Capacity  600 user I/O pins to support dense connectivity and multiple high-pin-count interfaces.
• Power  Core voltage operation specified between 820 mV and 880 mV, enabling designs that target supported low-voltage FPGA cores.
• Package  1760-BBGA, FCBGA package (supplier device package: 1760-HBGA, 45×45) for high-density board integration.
• Temperature and Grade  Industrial grade operation from –40°C to 100°C for deployment in temperature-demanding environments.
• Series Transceiver Capability (series-level)  Stratix V GX series documentation specifies GX channel transceiver speed grades up to 14.1 Gbps (series-level detail).
• Compliance  RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-speed communications  Leverage the Stratix V GX series transceiver capability for dense network and backplane interfaces where high serial bandwidth is required (series-level).
• Telecom and networking equipment  Large logic and memory resources with 600 I/Os enable packet processing, framing, and protocol handling in communication systems.
• High-performance signal processing  Substantial embedded RAM and logic capacity support FPGA-based DSP pipelines, buffering, and custom accelerators.

Unique Advantages

• High logic density: 840,000 logic elements allow implementation of large, integrated digital systems on a single device.
• Significant on-chip memory: Approximately 53.248 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O: 600 I/O pins support complex, multi-interface designs and high-pin-count peripherals.
• Industrial temperature range: Rated for –40°C to 100°C operation to meet temperature demands of industrial deployments.
• Compact, high-density package: 1760-BBGA (1760-HBGA, 45×45) package enables dense PCB layouts while retaining high I/O and logic capacity.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV aligns with the device’s specified power requirements.

Why Choose 5SGXEB9R2H43I3G?

The 5SGXEB9R2H43I3G positions itself as a high-density Stratix V GX FPGA suited to designs that require a large programmable fabric, substantial embedded memory, and a high I/O count within an industrial temperature envelope. Its 1760-BBGA package and defined core-voltage range make it appropriate for compact, performance-oriented boards where on-chip resources and temperature robustness are priorities.

Engineers and procurement teams targeting scalable, high-resource FPGA solutions will find this device aligns with applications demanding integrated logic, memory, and connectivity while maintaining compliance with RoHS requirements.

Request a quote or submit an RFQ to receive pricing and availability for the 5SGXEB9R2H43I3G.