5SGXEB9R2H43I2L

The 5SGXEB9R2H43I2L is a Stratix® V GX field-programmable gate array (FPGA) optimized for high-density logic and broad I/O integration. It combines a large logic fabric with substantial embedded RAM and a high I/O count to address demanding system-level designs.

This device is offered in an industrial grade package and is suitable for designs that require large on-chip memory, high I/O capacity, and strict operating temperature and supply specifications. As part of the Stratix V GX family, the series provides transceiver speed-grade options and both commercial and industrial speed offerings in the device family.

Key Features

• Logic Capacity 840,000 logic elements for complex combinational and sequential logic implementations.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources 600 I/Os to support high pin-count interfaces and dense board-level connectivity.
• Power Supply Core supply range of 820 mV to 880 mV, enabling predictable power budgeting for core domains.
• Package & Mounting Surface-mount FCBGA in a 1760-BBGA/1760-HBGA (45×45) package for compact, high-density board designs.
• Temperature Grade Industrial operating range from –40°C to 100°C for robust field deployment.
• RoHS Compliant Meets RoHS environmental requirements for reduced hazardous substances.
• Stratix V GX Family Characteristics Device family documentation includes transceiver speed-grade options and industrial/commercial speed grading for system-level planning.

Typical Applications

• High‑density networking and communications Leverage the large logic count, abundant I/Os, and Stratix V GX transceiver capabilities for packet processing, switching, and protocol bridging.
• Data center acceleration and compute offload Use substantial embedded RAM and logic capacity to implement custom accelerators and offload engines.
• Signal and image processing Implement complex processing pipelines and high-throughput I/O interfaces that benefit from on-chip memory and dense logic resources.

Unique Advantages

• High logic density: 840,000 logic elements allow integration of complex functions that reduce the need for multiple devices and lower system BOM.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM enables local buffering and state storage, improving throughput and latency for streaming applications.
• Large I/O footprint: 600 I/Os provide flexibility to interface with a wide range of peripherals, transceivers, and board-level buses without external multiplexing.
• Industrial robustness: Rated for –40°C to 100°C operation, supporting deployment in thermally demanding environments.
• Compact, production-ready package: 1760-ball FCBGA (1760-HBGA 45×45) surface-mount package supports high-density PCB layouts and automated assembly.
• Regulatory readiness: RoHS compliance simplifies environmental conformity for global product distribution.

Why Choose 5SGXEB9R2H43I2L?

The 5SGXEB9R2H43I2L positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that demand large logic fabrics, abundant embedded memory, and extensive I/O. Its package and thermal range support compact, rugged system implementations where integration and reliability are priorities.

This device is a fit for engineering teams developing networking, compute-acceleration, and signal-processing solutions that require scalable logic resources, ample on-chip RAM, and the I/O flexibility to interface with complex system architectures.

Request a quote or submit an inquiry to get pricing and availability for the 5SGXEB9R2H43I2L and to discuss volume, lead times, and technical support for your project.