5SGXEB9R2H43C3N

The 5SGXEB9R2H43C3N is a Stratix V GX family FPGA offered in a 1760-BBGA FCBGA package. This commercial-grade device delivers large programmable logic capacity, substantial embedded memory, and a high I/O count for complex digital designs.

Designed for applications that require high integration and board-level density, the device combines approximately 840,000 logic elements, roughly 53.25 Mbits of on-chip RAM, and 600 I/Os while operating within a defined voltage and temperature range.

Key Features

• Core Logic  Approximately 840,000 logic elements to implement large custom logic functions and complex state machines.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for data buffering, packet storage, and large lookup tables.
• I/O Density  600 user I/Os to support wide parallel interfaces and multiple high-pin-count peripherals.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier package 1760-HBGA (45×45), designed for surface-mount board assembly to maximize PCB routing density.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail designs.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant to meet common environmental and manufacturing requirements.
• Stratix V GX Family  Part of the Stratix V GX device family, with electrical characteristics and switching details defined in the Stratix V device documentation.

Typical Applications

• High-density custom logic  Implement large-scale state machines, protocol engines, and custom data-paths using the device's ~840,000 logic elements and abundant I/O.
• On-chip buffering and packet handling  Use the approximately 53.25 Mbits of embedded RAM for packet buffers, frame FIFOs, and temporary data storage.
• Complex system integration  Integrate multiple parallel and serial interfaces on a single device leveraging 600 I/Os and the 1760-BBGA package for compact board layouts.

Unique Advantages

• High integration density: Reduced board-level component count by consolidating large logic and memory requirements into a single FPGA package.
• Scalable I/O capacity: 600 I/Os enable flexible interface assignments and parallel connectivity for demanding system designs.
• Compact package footprint: 1760-BBGA surface-mount package supports dense PCB routing while maintaining high pin-count access.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation to match standard commercial product environments.
• Regulatory readiness: RoHS compliance supports environmentally constrained manufacturing flows.

Why Choose 5SGXEB9R2H43C3N?

The 5SGXEB9R2H43C3N offers a blend of large programmable logic, substantial embedded memory, and high I/O density in a single commercial-grade Stratix V GX FPGA package. Its power and thermal operating points, combined with the 1760-BBGA surface-mount package, make it a strong candidate for designs that require significant on-chip resources without sacrificing board-level density.

This device is well suited for engineering teams developing complex digital systems that demand high integration, predictable operating ranges, and RoHS-compliant manufacturing. The Stratix V family documentation provides the device-level electrical and switching characteristics needed for system design and validation.

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