5SGXEB9R2H43C2LN

The 5SGXEB9R2H43C2LN is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1760-BBGA FCBGA package. It delivers high logic density and on-chip memory with a large I/O count, packaged for surface-mount PCB assembly and specified for commercial temperature operation.

Designed for applications that require substantial programmable logic, embedded memory and extensive I/O, this device provides integration and capacity tied directly to its electrical and packaging specifications, including a nominal supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 840,000 logic elements for implementing large-scale digital designs.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM for buffering, state storage and large internal data structures.
• I/O Density  600 user I/Os to support wide parallel interfaces and extensive external connectivity.
• Device Capacity  Device contains roughly 317,000 LABs/CLBs equivalent (reported as 317000 in product data) to organize logic resources efficiently.
• Power Supply  Core supply range specified from 820 mV to 880 mV to meet the device’s operating requirements.
• Package & Mounting  1760-BBGA (FCBGA) package, supplier package 1760-HBGA (45×45), surface-mount mounting for high-density PCB designs.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support environmental and manufacturing requirements.

Typical Applications

• Large-scale programmable logic  Implement complex custom logic functions and state machines using approximately 840,000 logic elements and the device’s LAB/CLB capacity.
• On-chip buffering and data storage  Use approximately 53.248 Mbits of embedded RAM for packet buffering, frame storage or large internal FIFOs.
• High-pin-count interfacing  Leverage 600 I/Os for broad parallel bus interfaces, front-end connectivity, or extensive sensor and peripheral attachments.

Unique Advantages

• High integration density: The combination of ~840k logic elements and ~53.248 Mbits of embedded memory reduces external component count and simplifies board-level architecture.
• Broad I/O capability: 600 I/Os enable flexible, high-channel-count connectivity without immediate reliance on external multiplexing.
• Compact, manufacturable package: 1760-BBGA (FCBGA) surface-mount package supports high-density PCB designs while providing a standardized 45×45 supplier package footprint.
• Defined commercial operating range: Specified 0 °C to 85 °C operation and commercial grade classification simplify selection for commercial product deployments.
• Controlled core supply: Narrow core voltage range (820 mV–880 mV) supports predictable power design and system-level power budgeting.
• RoHS compliance: Meets environmental directives for lead-free manufacturing and global supply chain requirements.

Why Choose 5SGXEB9R2H43C2LN?

The 5SGXEB9R2H43C2LN offers a large programmable fabric and substantial embedded memory in a single, surface-mount FCBGA package, making it suitable for designs that require extensive on-chip resources and high I/O counts within a commercial temperature envelope. Its clear electrical and packaging specifications support predictable system integration and power planning.

This part is appropriate for engineering teams and procurement organizations seeking a high-density Stratix V GX device with verified on-chip resources and RoHS compliance. The device’s capacity and package choices provide a solid foundation for scalable, high-capacity FPGA implementations backed by Intel’s Stratix V device family documentation.

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