5SGXEB9R1H43I2N

The 5SGXEB9R1H43I2N is a Stratix V GX family FPGA from Intel, offered in a 1760-BBGA (FCBGA) package. This high-density device integrates 840,000 logic elements and approximately 53.248 Mbits of on-chip RAM to address designs that require large programmable logic capacity and embedded memory.

With up to 600 I/O pins and industrial-grade operating range, the device targets systems that need extensive I/O connectivity, substantial logic resources, and reliable operation across a wide temperature and supply range.

Key Features

• High Logic Density  840,000 logic elements provide extensive programmable logic capacity for complex SoC, signal processing, and protocol implementation.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM to support buffering, large data sets, and memory-intensive algorithms.
• Extensive I/O  600 dedicated I/O pins enable broad peripheral, board-level, and mezzanine connectivity for multi-channel systems.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to suit applications requiring extended temperature performance.
• Supply Voltage Range  Core supply specified between 870 mV and 930 mV for predictable power design and power-supply planning.
• Package and Mounting  1760-BBGA (FCBGA) surface-mount package (1760-HBGA, 45 × 45 mm supplier package reference) for high-pin-count board integration.
• Series Transceiver Capability (Stratix V GX family)  The Stratix V GX family includes high-speed transceiver speed grades (series documentation lists GX channel speed grades up to 14.1 Gbps), enabling high-bandwidth serial connectivity where required by the design.
• RoHS Compliant  Device conforms to RoHS requirements for environmental and regulatory considerations.

Typical Applications

• High‑Performance Networking: Leverage large logic capacity and family transceiver capabilities for packet processing, protocol offload, and line-card functions.
• Data Center Acceleration: Use abundant logic elements and embedded RAM for hardware acceleration of compute and storage-oriented workloads.
• Imaging and Signal Processing: Implement real-time image processing, beamforming, or DSP pipelines that benefit from large on-chip memory and extensive logic.
• Test & Measurement Systems: Deploy in instrumentation requiring many I/Os, configurable logic, and stable operation across broad temperatures.

Unique Advantages

• Large Programmable Resource Pool: 840,000 logic elements reduce the need for multiple devices by consolidating complex functions into a single FPGA.
• Substantial On-Chip Memory: Approximately 53 Mbits of embedded RAM supports deep buffering and on-chip data processing to lower external memory dependence.
• High I/O Count: 600 I/Os simplify board-level integration for multi-channel and mixed-signal interfaces without extensive multiplexing.
• Industrial Reliability: –40 °C to 100 °C rating provides operational headroom for demanding environments and extended-temperature deployments.
• Scalable High-Speed Options: As a Stratix V GX device, the family’s transceiver speed grades enable designs that require high-bandwidth serial links.
• Manufacturing-Friendly Package: 1760-BBGA (FCBGA) surface-mount package supports high-pin-count assembly and stable thermal/mechanical integration.

Why Choose 5SGXEB9R1H43I2N?

The 5SGXEB9R1H43I2N balances very high logic density, extensive embedded memory, and a large I/O complement in an industrial-temperature, surface-mount BBGA package. It is suited for engineers building systems that demand consolidated programmable logic, significant on-chip buffering, and broad connectivity while operating across a wide temperature range.

Choosing this Stratix V GX device supports scalable designs that may leverage the family’s high-speed transceiver capabilities and substantial resources to reduce BOM complexity and consolidate multi-function subsystems into a single FPGA solution.

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