5SGXEB9R1H43I2G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA

Quantity 1,061 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXEB9R1H43I2G – Stratix® V GX FPGA, 840,000 logic elements, 1760-BBGA

The 5SGXEB9R1H43I2G is an Intel Stratix® V GX field programmable gate array (FPGA) offered in a high-density, industrial-grade configuration. It provides 840,000 logic elements and approximately 53 Mbits of embedded memory in a compact 1760-BBGA (45×45) surface-mount package.

With 600 user I/O pins and an operating range designed for industrial environments, this device targets designs that require significant logic capacity, substantial on-chip RAM, and robust thermal tolerance.

Key Features

  • Core & logic capacity  840,000 logic elements to implement large-scale digital logic and custom accelerators.
  • Embedded memory  Approximately 53 Mbits of on-chip RAM for data buffering, state storage, and high-throughput processing.
  • I/O density  600 user I/O pins to support complex parallel interfaces and multiple peripheral connections.
  • Package & mounting  1760-BBGA, FCBGA (45×45) surface-mount package for high-density board integration.
  • Voltage supply  Core supply range from 870 mV to 930 mV for the device core rail.
  • Temperature & grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.
  • Environmental compliance  RoHS compliant.

Unique Advantages

  • High integration density: 840,000 logic elements allow consolidation of large designs onto a single device, reducing board count.
  • Significant on-chip memory: Approximately 53 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-path tasks.
  • Broad I/O capability: 600 I/O pins provide flexibility for diverse interface requirements and parallel data channels.
  • Industrial-ready thermal range: Rated for −40 °C to 100 °C to support deployment in demanding temperature environments.
  • Compact, high-density package: 1760-BBGA (45×45) surface-mount package supports high-pin-count designs in space-constrained layouts.
  • Regulatory alignment: RoHS compliance supports environmental and regulatory requirements.

Why Choose 5SGXEB9R1H43I2G?

The 5SGXEB9R1H43I2G combines high logic capacity, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA form factor. Its specification set makes it suitable for designs that require large programmable logic fabrics, significant on-chip RAM, and robust operating temperature margins.

Engineers selecting this device benefit from a high-density FPGA platform packaged for surface-mount integration and backed by Intel Stratix V family documentation and datasheet support for design and validation needs.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEB9R1H43I2G.

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