5SGXEB9R1H43I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 840000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,061 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXEB9R1H43I2G – Stratix® V GX FPGA, 840,000 logic elements, 1760-BBGA
The 5SGXEB9R1H43I2G is an Intel Stratix® V GX field programmable gate array (FPGA) offered in a high-density, industrial-grade configuration. It provides 840,000 logic elements and approximately 53 Mbits of embedded memory in a compact 1760-BBGA (45×45) surface-mount package.
With 600 user I/O pins and an operating range designed for industrial environments, this device targets designs that require significant logic capacity, substantial on-chip RAM, and robust thermal tolerance.
Key Features
- Core & logic capacity 840,000 logic elements to implement large-scale digital logic and custom accelerators.
- Embedded memory Approximately 53 Mbits of on-chip RAM for data buffering, state storage, and high-throughput processing.
- I/O density 600 user I/O pins to support complex parallel interfaces and multiple peripheral connections.
- Package & mounting 1760-BBGA, FCBGA (45×45) surface-mount package for high-density board integration.
- Voltage supply Core supply range from 870 mV to 930 mV for the device core rail.
- Temperature & grade Industrial grade device with an operating temperature range of −40 °C to 100 °C.
- Environmental compliance RoHS compliant.
Unique Advantages
- High integration density: 840,000 logic elements allow consolidation of large designs onto a single device, reducing board count.
- Significant on-chip memory: Approximately 53 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-path tasks.
- Broad I/O capability: 600 I/O pins provide flexibility for diverse interface requirements and parallel data channels.
- Industrial-ready thermal range: Rated for −40 °C to 100 °C to support deployment in demanding temperature environments.
- Compact, high-density package: 1760-BBGA (45×45) surface-mount package supports high-pin-count designs in space-constrained layouts.
- Regulatory alignment: RoHS compliance supports environmental and regulatory requirements.
Why Choose 5SGXEB9R1H43I2G?
The 5SGXEB9R1H43I2G combines high logic capacity, substantial embedded memory, and extensive I/O in an industrial-grade Stratix V GX FPGA form factor. Its specification set makes it suitable for designs that require large programmable logic fabrics, significant on-chip RAM, and robust operating temperature margins.
Engineers selecting this device benefit from a high-density FPGA platform packaged for surface-mount integration and backed by Intel Stratix V family documentation and datasheet support for design and validation needs.
Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEB9R1H43I2G.

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