5SGXEB9R1H43C2LG

The 5SGXEB9R1H43C2LG is a Stratix V GX field programmable gate array (FPGA) in a 1760-BBGA FCBGA package designed for commercial applications. It delivers high logic density, abundant embedded memory, and a large I/O complement for complex digital processing and system integration.

As a Stratix V GX device, this family supports GX transceiver speed grades as documented in the device datasheet, enabling designers to target demanding communication and processing use cases while operating within a commercial temperature range and low core-voltage envelope.

Key Features

• Core Logic  840,000 logic elements provide substantial programmable fabric for large-scale designs and parallel processing implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and on-chip data storage.
• I/O Capability  600 user I/Os for flexible interfacing to peripherals, external memory, and high-pin-count system connectivity.
• Package and Mounting  1760-BBGA (FCBGA) package; supplier device package listed as 1760-HBGA (45×45). Surface-mount mounting type simplifies PCB assembly for modern production flows.
• Power and Voltage  Core supply voltage range of 0.820 V to 0.880 V to match Stratix V core power requirements.
• Operating Temperature  Commercial-grade operation from 0 °C to 85 °C suitable for standard commercial electronics environments.
• RoHS Compliance  Device is RoHS compliant to support regulated manufacturing and environmental requirements.
• Series-Level Transceiver Support  Stratix V GX devices are offered with GX transceiver speed grades (documented in the datasheet) for high-speed channel options within the series.

Typical Applications

• High‑performance data processing  Use the large logic capacity and substantial embedded RAM to implement packet processing, custom accelerators, and parallel compute pipelines.
• High-density I/O systems  600 I/Os enable complex board-level interfacing, multi-channel sensor aggregation, and connectivity to memory or peripherals.
• Communications equipment  As a Stratix V GX device, the series’ transceiver speed grades can be used in line cards, backhaul equipment, and other communication endpoints (refer to the datasheet for supported transceiver grades).
• Prototyping and system integration  Surface-mount 1760-BBGA packaging and high logic density make this FPGA suitable for integrating advanced functions into prototype and production PCBs.

Unique Advantages

• High logic density: 840,000 logic elements enable complex, multi-function designs without external glue logic.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependency on external memory for buffering and temporary storage.
• Extensive I/O: 600 I/Os provide flexibility for high-pin-count designs and multiple parallel interfaces.
• Compact, production-ready package: 1760-BBGA (supplier package 1760-HBGA, 45×45) supports surface-mount assembly for volume production.
• Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial-environment deployment requirements.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose 5SGXEB9R1H43C2LG?

The 5SGXEB9R1H43C2LG combines substantial programmable logic, large on-chip memory, and a high I/O count in a production-ready package for commercial applications. It is well suited to system designs that require dense logic resources and flexible interfacing while operating within a low core-voltage range and standard commercial temperature window.

Designers and engineering teams targeting sophisticated digital processing, communication interfaces, and high-density I/O integration can leverage the Stratix V GX series characteristics documented in the datasheet to scale and validate system designs with confidence.

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