5SGXEB9R1H43C2L

The 5SGXEB9R1H43C2L is a Stratix® V GX family FPGA offering high on-chip logic and memory density in a 1760-BBGA (FCBGA) package. It combines a large number of logic elements with substantial embedded RAM and a high I/O count to address complex, high‑capacity FPGA implementations.

This device is targeted at designs that require large programmable logic capacity, significant embedded memory, and broad external connectivity while operating within commercial temperature ranges. The device’s low core voltage range supports modern low-voltage FPGA core architectures.

Key Features

• Logic Capacity  840,000 logic elements (cells) to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM for data buffering, FIFOs, and embedded storage.
• High I/O Count  600 I/O pins to support extensive peripheral interfaces and multi-channel connectivity.
• Package and Mounting  1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45 × 45 mm) with surface-mount assembly.
• Core Voltage  Core supply range of 820 mV to 880 mV to match low-voltage FPGA core requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Conforms to RoHS requirements for lead-free, environmentally compliant designs.

Typical Applications

• High-density digital processing  Implement large custom logic engines, signal processing pipelines, and complex state machines using the device’s 840,000 logic elements.
• Memory-centric designs  Use the approximately 53.2 Mbits of embedded RAM for buffering, packet storage, and on-chip data structures.
• Multi-interface systems  Leverage 600 I/Os to connect numerous peripherals, external memory, and multi-channel interfaces in compact system designs.

Unique Advantages

• High logic density: 840,000 logic elements enable consolidation of complex functions onto a single device, reducing board-level integration.
• Large on-chip RAM: Approximately 53.2 Mbits of embedded memory reduce dependence on external memory for many buffering and storage needs.
• Extensive I/O flexibility: 600 I/Os offer broad connectivity options for heterogeneous interfaces and multi-channel designs.
• Compact, manufacturable package: Available in a 1760-BBGA (FCBGA) with a 45 × 45 mm supplier HBGA footprint and surface-mount assembly for modern PCB workflows.
• Low-voltage core operation: Core supply between 0.820 V and 0.880 V aligns with low-power core designs.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream product deployments.

Why Choose 5SGXEB9R1H43C2L?

The 5SGXEB9R1H43C2L positions itself as a high-capacity Stratix V GX FPGA suitable for designs that demand a combination of very large programmable logic resources, sizable on-chip RAM, and a high I/O count in a single, surface-mount BGA package. Its voltage and temperature ratings make it appropriate for commercial applications where integration density and on-chip memory reduce board complexity and external component count.

Engineers building complex digital systems will find this FPGA useful for consolidating functionality, decreasing system BOM, and simplifying board-level interconnect through its abundant logic, memory, and I/O resources, backed by Stratix V device documentation.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEB9R1H43C2L FPGA.