5SGXEB6R3F43I4G

The 5SGXEB6R3F43I4G is an Intel Stratix® V GX family Field Programmable Gate Array (FPGA) supplied in a 1760-ball FCBGA package. This industrial-grade device delivers a high-density, configurable logic fabric with extensive I/O and on-chip memory for complex, performance-oriented designs.

With 597,000 logic elements, approximately 53.25 Mbits of embedded memory and 600 I/O pins, this FPGA targets designs that require large logic capacity, substantial embedded storage, and a broad external interface in a surface-mount package rated for industrial temperature ranges.

Key Features

• High Logic Capacity  Provides 597,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 53.25 Mbits of total on-chip RAM to support buffering, data processing, and state storage within the FPGA fabric.
• Extensive I/O  600 user I/O pins for wide peripheral and interface support across multiple external subsystems.
• Power Supply Range  Core/operating voltage specified from 820 mV to 880 mV to match system power-rail requirements.
• Industrial Temperature Grade  Rated to operate from −40 °C to 100 °C for reliable performance in industrial environments.
• Package & Mounting  1760-ball FCBGA (42.5×42.5 mm) surface-mount package suitable for high-density board integration; package case documented as 1760-BBGA, FCBGA.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing standards for restricted substances.

Typical Applications

• Industrial Control  High logic density and industrial temperature rating support control systems, PLCs, and factory automation that require robust digital processing.
• Network and Telecom Functionality  Large on-chip memory and abundant I/O enable packet buffering, protocol bridging, and interface aggregation in communication equipment.
• High-Density System Integration  Multiple I/O and a compact FCBGA package make the device suitable for space-constrained, high-performance embedded systems.

Unique Advantages

• Substantial Logic Resources:  597,000 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Significant On-Chip RAM:  Approximately 53.25 Mbits of embedded memory supports local buffering and accelerates data-path operations without external memory.
• Large I/O Count:  600 I/Os provide design flexibility for connecting to numerous peripherals, interfaces, or multi-lane data paths.
• Industrial Reliability:  Rated for −40 °C to 100 °C operation, suitable for extended-temperature deployments in industrial applications.
• Compact High-Performance Package:  1760-FCBGA (42.5×42.5 mm) enables dense PCB layouts while supporting a high pin-count implementation.
• Standards-Conscious Manufacturing:  RoHS compliance aligns with common environmental and regulatory requirements.

Why Choose 5SGXEB6R3F43I4G?

The 5SGXEB6R3F43I4G positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for demanding digital logic and embedded memory needs. Its combination of nearly 600k logic elements, more than 53 Mbits of on-chip RAM, and 600 I/Os makes it a fit for complex processing, interfacing, and buffering tasks where integration density and operating temperature range matter.

This device is appropriate for development teams and system designers seeking a scalable, high-density FPGA solution in a surface-mount FCBGA package, with RoHS compliance and industrial temperature qualifications that support durable deployments.

Request a quote today to evaluate the 5SGXEB6R3F43I4G for your next high-density, industrial FPGA design.