5SGXEB6R3F43I3LN

The 5SGXEB6R3F43I3LN is a Stratix V GX field programmable gate array (FPGA) offered in a 1760-FCBGA package. It provides a high-density programmable fabric with a large number of logic elements, abundant embedded memory, and a high I/O count for complex digital designs.

Designed for industrial-grade applications, this device targets systems that require significant integration of custom logic, deterministic I/O, and scalable on-chip memory resources while operating across a broad temperature range.

Key Features

• Logic Capacity — 597,000 logic elements for implementing large-scale custom logic and complex state machines.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 600 I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system integration.
• Package & Mounting — 1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for high-density board-level integration.
• Power Supply — Core supply specified between 820 mV and 880 mV to match system power-rail designs that align with the Stratix V core requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Built to meet RoHS environmental requirements.

Typical Applications

• Custom Digital Acceleration — Use the programmable fabric and large logic capacity to implement hardware-accelerated functions and algorithm-specific pipelines.
• System Integration — High I/O count and on-chip memory enable consolidation of multiple glue-logic and peripheral interfaces onto a single device.
• Industrial Control and Automation — Industrial temperature rating and robust packaging make it suitable for control systems and embedded automation platforms.

Unique Advantages

• High Logic Density: 597,000 logic elements allow the implementation of complex designs without immediate need for multiple FPGAs.
• Substantial On-Chip Memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary-storage needs.
• Extensive I/O: 600 I/Os provide flexibility for wide parallel buses, multiple interfaces, and high-pin-count connectivity.
• Industrial Reliability: Rated for −40 °C to 100 °C operation to meet demanding thermal requirements in industrial deployments.
• Compact Ball Grid Package: 1760-FCBGA (42.5 × 42.5 mm) offers a compact, surface-mount solution suitable for space-constrained boards.

Why Choose 5SGXEB6R3F43I3LN?

The 5SGXEB6R3F43I3LN pairs a high logic element count with significant embedded memory and a large I/O complement in a single industrial-grade FCBGA package. It is well suited for developers and system designers needing a programmable platform that consolidates complex logic, memory, and interfacing onto one device while meeting industrial temperature requirements.

This part is aimed at teams building advanced digital processing systems, integrated control platforms, and high-density FPGA-driven solutions that benefit from a mature device family and comprehensive device datasheet support.

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