5SGXEB6R3F43I4N

The 5SGXEB6R3F43I4N is an Intel Stratix V GX FPGA in a 1760-FCBGA package, designed for applications that require very large logic capacity, substantial on-chip memory, and high I/O density. Provided as an industrial-grade device, it supports core supply voltages from 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C.

With 597,000 logic elements, approximately 53.2 Mbits of embedded memory, and 600 I/Os, this device targets complex digital designs that demand high integration and robust thermal and voltage operating windows.

Key Features

• Logic Capacity  597,000 logic elements for large-scale combinational and sequential logic implementations.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive processing.
• I/O Density  600 I/Os to accommodate extensive peripheral connectivity and high pin-count interfaces.
• Power and Supply  Core supply voltage specified at 0.82–0.88 V, enabling precise power budgeting for system-level design.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density PCB implementations.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation, suitable for demanding environmental conditions.
• Standards Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• High-density digital processing  Large logic capacity and abundant embedded memory support complex algorithms, signal processing, and FPGA-based accelerators.
• High I/O systems  600 I/Os enable extensive interface routing for multi-channel data acquisition, communication gateways, and instrument front-ends.
• Industrial control and automation  Industrial temperature rating and robust packaging make the device suitable for factory automation controllers and industrial instrumentation.
• Memory-intensive designs  Substantial on-chip RAM accommodates buffering and packet handling where low-latency local storage is required.

Unique Advantages

• Massive logic resource: 597,000 logic elements allow consolidation of multiple subsystems into a single FPGA, reducing board-level complexity.
• Significant embedded RAM: Approximately 53.2 Mbits of on-chip memory reduces dependence on external memory for many buffering and processing tasks.
• High I/O count: 600 I/Os provide flexibility to support wide bus interfaces, multi-channel sensors, or dense connectivity without external multiplexing.
• Industrial operating range: Rated −40 °C to 100 °C to maintain operation across typical industrial temperature extremes.
• Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) allows high integration density on board designs while supporting surface-mount assembly.
• RoHS compliant: Meets environmental manufacturing requirements for material compliance.

Why Choose 5SGXEB6R3F43I4N?

The 5SGXEB6R3F43I4N delivers a combination of very large logic capacity, substantial on-chip memory, and a high I/O count within an industrial-temperature, surface-mount FCBGA package. These characteristics make it well suited to system designs that require consolidation of complex digital functions, large buffering capability, and extensive external connectivity under robust environmental conditions.

As part of the Intel Stratix V GX family, this device provides a predictable platform for engineers and procurement teams seeking a high-capacity FPGA solution with defined electrical and thermal operating bounds. Its package and pin count support dense PCB implementations while its RoHS compliance aligns with common manufacturing requirements.

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